PS240128WRF Powertip Technology, PS240128WRF Datasheet - Page 23

• Manufacturer Part Number: PS240128WRF
• Description: Standard Value
• Manufacturer: Powertip Technology

PE240128WRF-001-HQ
NO
10
6
7
8
A=( L + W ) ╱2
A=( L + W ) ╱2
A=( L + W ) ╱2
A=( L + W ) ╱2
characteristic of
Assembly parts
Appearance of
Appearance of
Electrical
backlight
molding
frame
Item
VER.0
The shape of modeling is deformed by touching.
Insufficient epoxy: Circuit or pad of IC is visible
Excessive epoxy: Diameter of modeling is > 20mm
or height is > 2.5mm
The diameter of pinhole in modeling, A is > 0.2mm.
The folding angle of frame must be > 45°+ 10°
The area of stripped electroplate in top-view of
frame, A is > 1.0mm.
Rust or crack is (Top view only)
The scratched width of frame is > 0.06mm.
The color of backlight is nonconforming
Backlight can’t work normally.
The LED lamp can’t work normally
The unsoldering area of pin for backlight,
The height of solder pin for backlight is > 2.0mm
The mark or polarity of component is unidentifiable.
The height between bottom of component and
surface of the PCB is floating > 0.7mm
D > 1/4W
End solder joint width, D’ is > 50% width of
component termination or width of pad
Side overhang, D is > 25% width of component
termination.
Component is cracked, deformed, and burned, etc.
The polarity of component is placed in inverse
direction.
Maximum fillet height of solder extends onto the
component body or minimum fillet height
is < 0.5mm.
(Top view only)
A is > 1/2 solder joint area.
W
D’
Specification
Page23
Pad
D
Judge Level
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
N.G.
Major
Minor
Minor
Minor
Minor
Minor
Major
Major
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Major
Minor