FPD750SOT343CE Filtronic, FPD750SOT343CE Datasheet - Page 11

• Manufacturer Part Number: FPD750SOT343CE
• Description: LOW NOISE HIGH LINEARITY PACKAGED PHEMT
• Manufacturer: Filtronic

PCB F
P
This package is compatible with both lead free
and leaded solder reflow processes as defined
within IPC/JEDEC J-STD-020C. The maximum
package temperature should not exceed
260°C.
H
T
b
Electrostatic Discharge (ESD) precautio
s
handling, assembly, and testing.
E
These devices should be treated as Class 1A
(250V - 500V) using the human body model as
defined in JEDEC Standard No. 22-A114.
The device has a MSL rating of Level 1. To
determine this rating, preconditioning was
performed to the device per, the Pb-free solder
hould be observed at all stages of storage,
e
o avoid damage to the devices care should
REFERRED
SD/MSL R
ANDLING
Tel: [phone]
exercised
OOT
P
P
RECAU
A
ATING
RINT
SSEMBLY
during
Units in inches
:
TIONS
handling.
I
NSTRUCTIONS
Fax: [phone]
:
Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Proper
:
ns
11
Email: [e-mail]
profile defined within IPC/JEDEC J-STD-020C,
Moisture / Reflow sensitivity classification for
non-hermetic solid state surface mount devices
A
Application Notes and design data including S-
parameters, noise parameters and device
model are available on request.
R
A MTTF of 4.2 million hours at a channel
temperature of 150°C is achieved for the
process used to manufacture this device.
D
This product is not designed for use in any
space based or life sustaining/supporting
equipment.
O
PPLICATION
ELIABILITY
ISCLAIMERS
RDERING INFORMATION
P
FPD750SOT343CE
EB750SOT343-BG
EB750
EB750
EB750SOT343-BC
EB750SOT343-BE
EB750SOT343-AH
FPD750SOT343E
FPD750SOT343
ART
SOT343-BB
SOT343-BA
N
UMBER
:
:
N
FPD750SOT343
OTES
RoHS Compliant P
Website:
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ESIGN
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ESCRIPTION
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EM
ATA
Datasheet v3.0
T
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