HFA3096 Intersil Corporation, HFA3096 Datasheet - Page 10

• Manufacturer Part Number: HFA3096
• Description: Ultra High Frequency Transistor Arrays
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
53 mils x 52 mils x 19 mils
1340µm x 1320µm x 483µm
Type: Metal 1: AlCu(2%)/TiW
Thickness: Metal 1: 8k
Type: Metal 2: AlCu(2%)
Thickness: Metal 2: 16k
Å
Å
±0.4k
10
±0.8k
Å
Å
HFA3046, HFA3096, HFA3127, HFA3128
(53 mils)
1340µm
(53 mils)
1340µm
Pad numbers correspond to SOIC pinout.
HFA3096, HFA3127, HFA3128
3
4
5
6
3
4
5
6
2
7
2
7
HFA3046
(52 mils)
(52 mils)
1320µm
1320µm
1
8
1
8
14
16
9
PASSIVATION:
PROCESS:
SUBSTRATE POTENTIAL: (POWERED UP)
13
Type: Nitride
Thickness: 4k
UHF-1
Unbiased
15
10
9
12
11
10
14
13
12
11
Å
±0.5k
Å
December 21, 2005
FN3076.13