CMS15 TOSHIBA Semiconductor CORPORATION, CMS15 Datasheet
CMS15
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CMS15 Summary of contents
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... JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max ⎯ ⎯ 0.43 ⎯ ⎯ 0.49 ⎯ 0.55 0.58 ⎯ ⎯ 1.0 ⎯ 25 300 ⎯ ⎯ 102 ⎯ ⎯ 60 ⎯ ⎯ 135 ⎯ ⎯ 210 ⎯ ⎯ 16 2006-11-13 CMS15 Unit: mm Unit V μA pF °C/W °C/W ...
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... Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. 4) Please refer to the Rectifiers databook for further information. Unit: mm 1.4 has a temperature coefficient of 0.1%/°C. Take RRM curve. F (AV) of below 120° CMS15 2006-11-13 ...
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... Soldering land: 6.0 mm × 6.0 mm board thickness: 1.6 t Device mounted on a ceramic board: board size × Soldering land: 2.0 mm × 2.0 mm board thickness: 0.64 t 0.1 0 Time t (s) 3 CMS15 P – (AV) F (AV) DC 180° 120° α = 60° Rectangular waveform α 0° 360° ...
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... Rectangular waveform 0° Conduction angle α 0 125°C 0.2 0.1 0.0 140 160 CMS15 Surge forward current (non-repetitive 25° 100 Number of cycles P – V (typ.) R (AV) R 360° DC α 300° 240° 180° ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMS15 20070701-EN 2006-11-13 ...