CMH07 TOSHIBA Semiconductor CORPORATION, CMH07 Datasheet - Page 3

no-image

CMH07

Manufacturer Part Number
CMH07
Description
Toshiba High Efficiency Rectifier Silicon Epitaxial Type
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CMH07
Manufacturer:
TOSHIBA
Quantity:
99 000
Part Number:
CMH07
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
CMH07 TE12L
Manufacturer:
TOSHIBA
Quantity:
36 000
Part Number:
CMH07 TE12R
Manufacturer:
TOSHIBA
Quantity:
36 000
Part Number:
CMH07(T2L,TEMQ)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
0.01
100
0.1
10
160
140
120
100
80
60
40
20
1
0
0.2
0
Pulse test
Rectangular
Waveform
180°
Instantaneous forward voltage v F
360°
0.4
0.4
Average forward current I
75°C
1000
0.6
500
300
100
50
30
10
0.001
0.8
5
3
1
Ta max – I
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
150°C
0.8
i
F
0.003
1.2
– v
F
1.0
F (AV)
T j = 25°C
0.01
1.6
1.2
F (AV)
0.03
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 2.1 mm × 1.4 mm
board thickness: 1.6 t
2.0
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 t
(A)
1.4
(V)
0.1
1.6
2.4
0.3
Time t (s)
r
th (j-a)
3
1
– t
3
160
140
120
100
2.4
1.2
0.8
0.4
80
60
40
20
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
0
0
0
0
10
Rectangular
Waveform
180°
360°
Average forward current I F (AV) (A)
0.4
0.4
Average forward current I
30
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 t
0.8
100
0.6
P
Ta max – I
F (AV)
300
1.2
1.2
– I
F (AV)
F (AV)
1000
1.6
1.6
F (AV)
Rectangular
Waveform
180°
360°
2.0
2.0
(A)
2006-11-08
CMH07
2.4
2.4

Related parts for CMH07