CMF01 TOSHIBA Semiconductor CORPORATION, CMF01 Datasheet
CMF01
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CMF01 Summary of contents
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... CMF01 = 600 V RRM = 2 100 ns (max.) rr (Ta = 25°C) Symbol Rating Unit V 600 V RRM I 2.0 (Note (AV (50 Hz) A FSM −40~150 T °C j −40~150 T °C stg 1 CMF01 Unit: mm ⎯ JEDEC ⎯ JEITA TOSHIBA 3-4E1A Weight: 0.023 g (typ.) 2006-11-07 ...
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... R th (j-a) (soldering land × 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size × 50 mm) (soldering land: 2.1 mm × 1.4 mm) (board thickness: 1.6 t) ⎯ (j-ℓ) Standard Soldering Pad 1.4 2 CMF01 Min Typ. Max ⎯ 1.4 2.0 ⎯ ⎯ 50 ⎯ ⎯ 100 ⎯ ⎯ ...
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... Average forward current I 1000 Device mounted on a glass-epoxy board (board size × 50 mm, land size: 2.1 mm × 1.4 mm, board thickness: 1.6 t) 100 10 1 0.001 0.01 100 3 CMF01 P – (AV) F (AV) 180° Rectangular 120° waveform α 0° 360° Conduction angle α 0.8 1.2 1.6 2.0 2.4 2.8 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 4 CMF01 20070701-EN 2006-11-07 ...