CMF04 TOSHIBA Semiconductor CORPORATION, CMF04 Datasheet - Page 2

• Manufacturer Part Number: CMF04
• Description: Diodes Toshiba Fast Recovery Diode Silicon Diffused Type
• Manufacturer: TOSHIBA Semiconductor CORPORATION

Electrical Characteristics
Marking
Handling Precautions
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a
moment. Do not exceed any of these ratings.
The following are the general derating methods we recommend for designing a circuit using this device.
V
I
This rating specifies the non-repetitive peak current in one cycle of a 50 Hz sine wave, condition angle 180°. Therefore
the rating applies only to abnormal operation, which seldom occurs during the lifespan of a device.
For this device, we recommend a T
Thermal resistance between junction and ambient fluctuates depending on the mounting condition of the device. When
using the device, be sure to design the circuit board and soldering land size to match the appropriate thermal resistance
value.
Refer to the Rectifier databook for further information.
F(AV)
RRM
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery time
Thermal resistance
Thermal resistance (junction to lead)
Abbreviation Code
: We recommend that the worst-case current be no greater than 80% of the absolute maximum rating of I
: We recommend that the worst-case voltage, including surge voltage, be no greater than 80% of the absolute
maximum rating of V
V
designing a device for use at low temperature.
Carry out sufficient heat design. If it is not possible to design a circuit with excellent heat radiation, set a margin by
using an allowable Tamax-I
RRM
F4
has a temperature coefficient (0.1%/℃). Be sure to take this temperature coefficient into account when
Characteristic
RRM
CMF04
Part No.
for a DC circuit; and no greater than 50% of that of V
F (AV)
j
of below 120℃ under the worst load and heat radiation conditions.
(Ta = 25°C)
curve.
Symbol
R
R
I
V
RRM
th (j-a)
th (j-ℓ)
trr
tfr
FM
I
V
I
I
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 mm)
Device mounted on a glass-epoxy
board
(board size: 50 mm × 50 mm)
(soldering land: 2.1 mm × 1.4 mm)
(board thickness: 1.6 mm)
FM
F
F
RRM
= 1 A, di/dt =-30 A/μs
= 1 A
= 0.5 A (pulse test)
= 800 V (pulse test)
2
Standard Soldering Pad
Test Condition
1.4
⎯
3.0
RRM
for an AC circuit.
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1.4
Unit: mm
Typ.
550
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2008-05-13
Max
100
135
210
2.5
50
60
16
⎯
CMF04
°C/W
°C/W
Unit
μA
F(AV)
ns
ns
V
.