ST72325R6-AUTO STMicroelectronics, ST72325R6-AUTO Datasheet - Page 232

• Manufacturer Part Number: ST72325R6-AUTO
• Description: 8-bit Mcu For Automotive With 16 To 60 Kbyte Flash, Adc, Css, 5 Timers, Spi, Sci, I2c Interface
• Manufacturer: STMicroelectronics

Package characteristics
20.2
20.3
20.3.1
232/250
Thermal characteristics
Table 142. Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering information
In accordance with the RoHS European directive, all STMicroelectronics packages have
been converted to lead-free technology, named ECOPACK
●
●
Compatibility
ECOPACK
process (see application note AN2034).
Table 143. Soldering compatibility (wave and reflow soldering process)
of an application can be defined by the user with the formula: P
internal power (I
application.
Symbol
ECOPACK
soldering profile.
Detailed information on the STMicroelectronics ECOPACK
available on www.st.com/stonline/leadfree/, with specific technical application notes
covering the main technical aspects related to lead-free conversion (AN2033, AN2034,
AN2035 and AN2036).
Package
LQFP32
LQFP44
LQFP64
T
R
P
Jmax
thJA
D
®
LQFP packages are fully compatible with lead (Pb) containing soldering
®
DD
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
packages are qualified according to the JEDEC STD-020B compliant
NiPdAu (nickel-palladium-gold)
Sn (pure tin)
x V
DD
) and P
Plating material
PORT
(1)
is the port power dissipation depending on the ports used in the
Ratings
(2)
LQFP64
LQFP64
LQFP44
LQFP32
Pb solder paste
D
D
= P
= (T
14x14
10x10
10x10
7x7
INT
®
Yes
J
-T
.
+ P
A
) / R
®
PORT
transition program is
thJA
where P
. The power dissipation
Value
500
150
Pb-free solder paste
47
50
52
70
ST72325xxx-Auto
INT
is the chip
Yes
°C/W
Unit
mW
°C