UBA2024 NXP Semiconductors, UBA2024 Datasheet - Page 8

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UBA2024

Manufacturer Part Number
UBA2024
Description
Half-bridge Power Ic For Cfl Lamps
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
PACKAGE OUTLINES
2004 Feb 03
DIP8: plastic dual in-line package; 8 leads (300 mil)
Half-bridge power IC for CFL lamps
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT97-1
max.
0.17
4.2
A
min.
0.02
0.51
A
1
L
050G01
max.
0.13
A
3.2
IEC
Z
2
8
1
pin 1 index
0.068
0.045
1.73
1.14
b
b
D
e
0.021
0.015
0.53
0.38
b
1
MO-001
JEDEC
0.042
0.035
1.07
0.89
4
5
b
b
REFERENCES
1
2
0
A
b
0.014
0.009
1
2
0.36
0.23
w
c
A
E
M
2
SC-504-8
JEITA
scale
D
0.39
0.36
A
9.8
9.2
5
8
(1)
6.48
6.20
0.26
0.24
E
(1)
10 mm
2.54
0.1
e
7.62
0.3
e
1
c
3.60
3.05
0.14
0.12
(e )
M
L
M
PROJECTION
H
EUROPEAN
1
E
8.25
7.80
0.32
0.31
M
E
10.0
0.39
0.33
M
8.3
Product specification
H
ISSUE DATE
UBA2024
0.254
0.01
99-12-27
03-02-13
w
SOT97-1
0.045
max.
1.15
Z
(1)

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