UBA2032 NXP Semiconductors, UBA2032 Datasheet - Page 9

• Manufacturer Part Number: UBA2032
• Description: Full Bridge Driver Ic
• Manufacturer: NXP Semiconductors

Philips Semiconductors
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with “General Quality Specification for Integrated Circuits: SNW-FQ-611” .
CHARACTERISTICS
T
specified.
2005 Mar 24
R
High voltage
I
I
I
I
I
Start-up; powered via pin HV
I
V
V
V
V
Start-up; powered via pin V
I
V
V
V
j
HV
FSL
EXTDR
+LVS
i(HV)
i(DD)
SYMBOL
SYMBOL
HV(rel)
HV(UVLO)
HV(hys)
DD
DD(rel)
DD(UVLO)
DD(hys)
th(j-a)
= 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC; unless otherwise
LVS
Full bridge driver IC
, I
FSR
thermal resistance from junction to ambient
high voltage supply current
high voltage floating supply
current
supply current on pin EXTDR
supply current on pin +LVS
supply current on pin LVS
HV input current
level of release power drive
voltage
reset level of power drive voltage
HV hysteresis voltage
internal supply voltage
V
level of release power drive
voltage
reset level of power drive voltage
hysteresis voltage
DD
UBA2032T
UBA2032TS
input current
PARAMETER
DD
PARAMETER
t < 0.5 s and V
t < 0.5 s and V
t < 0.5 s and V
t < 0.5 s and V
t < 0.5 s and V
V
V
V
HV
HV
DD
= 11 V; note 1
= 20 V
= 8.25 V; note 2
9
CONDITIONS
HV
FSL
EXTDR
+LVS
in free air
LVS
= 550 V
CONDITIONS
= V
= 464 V
= 450 V
= 464 V
FSR
= 564 V
0
0
0
0
0
11
8.5
2.0
10.5
8.25
5.75
2.0
MIN.
VALUE
100
80
0.5
12.5
10
2.5
11.5
0.5
9.0
6.5
2.5
TYP.
Product specification
UBA2032
30
30
30
30
30
1.0
14
11.5
3.0
13.5
1.0
9.75
7.25
3.0
MAX.
UNIT
K/W
K/W
mA
V
V
V
V
mA
V
V
V
UNIT
A
A
A
A
A