SHF-0589 Sirenza Microdevices, SHF-0589 Datasheet - Page 4

• Manufacturer Part Number: SHF-0589
• Description: 0.05-3 Ghz, 2 Watt Gaas Hfet
• Manufacturer: Sirenza Microdevices

303 S. Technology Ct.
Broomfield, CO 80021
Pin #
4
1
2
3
Mounting and Thermal Considerations
It is very important that adequate heat sinking be
provided to minimize the device junction
temperature. The following items should be
implemented to maximize MTTF and RF
performance.
1. Multiple solder-filled vias are required directly
below the ground tab (pin 4). [CRITICAL]
2. Incorporate a large ground pad area with
multiple plated-through vias around pin 4 of the
device. [CRITICAL]
3. Use two point board seating to lower the thermal
resistance between the PCB and mounting plate.
Place machine screws as close to the ground tab
(pin 4) as possible. [CRITICAL]
4. Use 2 ounce copper to improve the PCB’s heat
spreading capability. [CRITICAL]
5. Thermal transfer paste should be used between
the PCB and the mounting plate to improve heat
spreading capability. [RECOMMENDED]
Caution: ESD sensitive
Appropriate precautions in handling, packaging and
testing devices must be observed.
Function
Source
Source
Drain
Gate
Pin Description
RF Input
Connection to ground. Use via holes to reduce lead
inductance. Place vias as close to ground leads as possible.
RF Output
Same as Pin 2
Recommended Mounting Configuration for
Optimum RF and Thermal Performance
Description
(0.020" DIA)
Plated Thru
Machine
Screws
Holes
Phone: (800) SMI-MMIC
4
Not Recommended for New Designs
Ground Plane
The part will be symbolized with the “H5”
designator and a dot signifying pin 1 on the top
surface of the package.
Part Number Ordering Information
Part Number
SHF-0589
SHF-0x89
.177 .068
Package Dimensions
DIMENSIONS ARE IN INCHES
.059
Part Symbolization
Reel Size
.096
SHF-0589 2 Watt HFET
.161
7"
http://www.sirenza.com
.016
Devices/Reel
OBSOLETE
.041
.019
.015
1000
.118
EDS-101242 Rev G