BUW11F NXP Semiconductors, BUW11F Datasheet - Page 9
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BUW11F
Manufacturer Part Number
BUW11F
Description
Silicon Diffused Power Transistors
Manufacturer
NXP Semiconductors
Datasheet
1.BUW11F.pdf
(12 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Philips Semiconductors
PACKAGE OUTLINE
1997 Aug 14
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3 leads (in-line)
Silicon diffused power transistors
Note
1. Terminals in this zone are not tinned.
DIMENSIONS (mm are the original dimensions)
UNIT
mm
OUTLINE
VERSION
SOT199
5.2
4.8
A
3.4
3.0
A 1
1.2
1.0
b
D
L
2.1
1.9
b 1
IEC
m
b 1
0.6
0.5
c
1
21.5
20.5
D
e
15.3
14.7
JEDEC
2
E
E 1
e 1
E
P
7.8
6.8
REFERENCES
E 1
b
3
5.45
e
0
10.9
e 1
L 1
scale
EIAJ
q
w
9
5
M
16.5
15.7
L
10 mm
L 1
3.7
3.3
(1)
0.8
0.6
m
3.3
3.1
P
Q
A 1
2.1
1.9
A
Q
c
BUW11F; BUW11AF
PROJECTION
6.2
5.8
EUROPEAN
q
0.4
w
45
Product specification
ISSUE DATE
97-06-27
SOT199