MR18R1628EG0 Samsung Semiconductor, Inc., MR18R1628EG0 Datasheet - Page 14

• Manufacturer Part Number: MR18R1628EG0
• Description: The Rimm Module Is A General Purpose High- Performance Memory Module Suitable For Use In A Broad Range Of Applications Including Computer Memory, Personal Computers, Workstations And Other Applications Where High Bandwidth And Low Latency Are Requi
• Manufacturer: Samsung Semiconductor, Inc.

MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Physical Dimensions -4 ( For Heat Spreader )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of ±0.127[±0.005].
WARNING ! HOT SURFACE
SECTION A-A
DIA 2.36
WARNING ! HOT SURFACE
±
Heat Spreader
0.05[0.09
Thermal
Conductive
Gap Filling
Material
[ Single side module ]
±
0.001]
12.7
±
0.07[0.5
Figure 6: Heat Spreader Physical Dimensions
Max 4.70
[0.050
CSP
[0.185]
PCB
1.27
120.66
108.81
±
0.002]
127
Center-Point
±
±
0.10
0.004]
±
±
±
0.25[5.0
0.12[4.748
0.12[4.283
133.35
12.7
127
±
±
±
±
0.25[5.0
0.07[0.5
0.127[5.250
0.009]
±
±
A
A
0.005]
0.005]
Page 13
http://www.samsungsemi.com
±
±
0.009]
0.002]
±
0.005]
http://www.samsungsemi.com
SECTION A-A
[ Double side module ]
Version 1.0 May 2004
[0.050
Heat Spreader
1.27
PCB
CSP
Max 7.80
Thermal
Conductive
Gap Filling
Material
[0.307]
±
±
0.10
0.004]
[0.04
2.9
1.00
[0.114]
±
±
0.002]
0.07