MR18R1628EG0 Samsung Semiconductor, Inc., MR18R1628EG0 Datasheet - Page 2

• Manufacturer Part Number: MR18R1628EG0
• Description: The Rimm Module Is A General Purpose High- Performance Memory Module Suitable For Use In A Broad Range Of Applications Including Computer Memory, Personal Computers, Workstations And Other Applications Where High Bandwidth And Low Latency Are Requi
• Manufacturer: Samsung Semiconductor, Inc.

MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Overview
The RIMM
memory module suitable for use in a broad range of applica-
tions including computer memory, personal computers,
workstations and other applications where high bandwidth
and low latency are required.
The RIMM module consists of 256/288Mb RDRAM
devices. These are extremely high-speed CMOS DRAMs
organized as 16M words by 16 or 18 bits. The use of
Rambus Signaling Level (RSL) technology permits up to
1066 MHz transfer rates while using conventional system
and board design technologies. RDRAM
capable of sustained data transfers at 0.94 ns per two bytes
(7.5ns per 16 bytes).
The RDRAM architecture enables the highest sustained
bandwidth for multiple, simultaneous, randomly addressed,
memory transactions. The separate control and data buses
with independent row and column control yield over 95%
bus efficiency. The RDRAM device's 32-bank architecture
supports up to four simultaneous transactions per device.
Features
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(16Mx16)*4(8/16)pcs RIMM
(16Mx18)*4(8/16)pcs RIMM
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(5.25” x 1.25” x 0.05”) - 256Mb and 288Mb base PC800
RIMM Module
(5.25” x 1.375” x 0.05”) - 256Mb and 288Mb base
PC1066 RIMM Module
Each RDRAM device has 32 banks, for a total of 512, 256,
128 banks on each 512/576MB, 256/288MB, 128/144MB
module respectively
High speed up to 1066 MHz RDRAM storage
184 edge connector pads with 1mm pad spacing
Module PCB size : 133.35mm x 31.75mm x 1.27mm
Gold plated edge connector pad contacts
Serial Presence Detect(SPD) support
Operates from a 2.5 volt supply (±5%)
Powerdown self refresh modes
Separate Row and Column buses for higher efficiency
WBGA lead free package (92/84 balls)
Module PCB size : 133.35mm x 34.93mm x 1.27mm
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module is a general purpose high- performance
Note: On double sided modules, RDRAM devices are also installed on bottom side of PCB.
Figure 1: RIMM Module shown with heat spreader removed
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Module based on 288Mb E-die, 32s banks,16K/32ms Ref, 2.5V
Module based on 256Mb E-die, 32s banks,16K/32ms Ref, 2.5V
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devices are
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Page 1
Key Timing Parameters/Part Numbers
The following table lists the frequency and latency bins
available for RIMM modules.
Form Factor
The RIMM modules are offered in 184-pad 1mm edge
connector pad pitch suitable for 184 contact RIMM connec-
tors. Figure 1 below, shows a sixteen device RIMM module.
Organization
128M x 16/18
256M x 16/18
64M x 16/18
Table 1: Part Number by Freq. & Latency
-CM8
-CM8
-CM8
-CK8
-CK8
-CK8
-CT9
-CT9
-CT9
Bin
(MHz)
Freq.
1066
1066
1066
Speed
I/O
800
800
800
800
800
800
Version 1.0 May 2004
Time) ns
Access
(Row
t
32P
32P
32P
RAC
40
45
40
45
40
45
MR16/18R162GEG0-CM8
MR16/18R1624EG0-CM8
MR16/18R1628EG0-CM8
MR16/18R162GEG0-CK8
MR16/18R1624EG0-CK8
MR16/18R1628EG0-CK8
MR16/18R162GEG0-CT9
MR16/18R1624EG0-CT9
MR16/18R1628EG0-CT9
Part Number