MSS40_1 ST Microelectronics, Inc., MSS40_1 Datasheet - Page 3
MSS40_1
Manufacturer Part Number
MSS40_1
Description
Thyristormodule
Manufacturer
ST Microelectronics, Inc.
Datasheet
1.MSS40_1.pdf
(6 pages)
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Fig. 1 : Maximun RMS power dissipation versus RMS
on-state current.
(F= 50 Hz)
Fig. 3 : RMS on-state current versus case temperature.
Fig. 5 : Relative variation of gate trigger and holding
current versus junction temperature.
P(W)
I T(RMS)(A)
Igt;Ih [Tj] / Igt; Ih [Tj=25oC]
Ih
Igt
Tj(oC)
Tcase( C)
o
=180
o
Fig. 2 : Correlation between maximum RMS power dis-
sipation and maximum allowable temperature (Tamb)
for different thermal resistances heatsink + contact.
Fig. 4: Thermal transient impedance junction to case
versus pulse duration.
Fig. 6 : Non repetitive surge peak on-state current ver-
sus number of cycles.
Zth(j-c) (oC/W)
P (W)
I TSM(A)
Rth=O.75 C/W
Rth=1.5 C/W
Rth=1.0 C/W
Number of cycles
o
o
o
Tamb( C)
o
Tj initial = 25 C
Rth=O C/W
tp(s)
o
MSS40
0
3/6