BCR Vishay Intertechnology, BCR Datasheet
BCR
Manufacturer Part Number
BCR
Description
20 X 20 Ta2 N Back-contact on Silicon
Manufacturer
Vishay Intertechnology
Datasheet
1.BCR.pdf
(2 pages)
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The Back Contact Resistor (BCR) series single-value back-
contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films (EFI)
sophisticated thin film equipment and manufacturing technol-
ogy. The BCRs are 100% electrically tested and visually inspected
to MIL-STD-883.
BCR
Vishay Electro-Films
www.vishay.com
54
APPLICATIONS
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact
connecting the resistor to the bottom of the chip.)
VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 • GERMANY +49.9287.710 FAX: +49 9287.70435 • ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
10
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100Ω - 250kΩ
< 100Ω or > 251kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 hours, + 125°C, 125mW
Operating temperature range
Thermal shock, MIL-STD-202,
Method 107, Test condition F
High temperature exposure,
+ 150°C, 100 hours
Dielectric voltage breakdown
Insulation resistance
Operating voltage
DC power rating at + 70°C
(derated to zero at + 175°C)
5 x rated power short-time
overload, + 25°C, 5 seconds
Ω
10%
20
Ω
• ITALY + 39.2.300.11911 FAX: +39.2.300.11999 • JAPAN +81.42.729.0661 FAX: +81.42.729.3400 • SINGAPORE +65.788.6668 FAX: +65.788.0988
5%
• SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 • UK +44 191 514 8237 FAX: +44 1953 457 722 • USA: (401) 738-9150 FAX: (401) 738-4389
50
Ω
2%
Tightest Standard Tolerance Available
100
Ω
1%
200
Ω
0.5%
±
1K
250ppm/
Ω
±
Thin Film, Back-Contact Resistor
100ppm/
±
±
50ppm/
25ppm/
°
C
°
C
°
C
°
0.1%
C
200K
Product may not
Ω
be to scale
360K
Ω
620K
Ω
1M
Ω
FEATURES
• Only one wire bond required
• Small size: 0.020 inches square.
• Resistance range: 10Ω to 1MΩ
• Oxidized silicon substrate for good power dissipation
• Resistor material: tantalum nitride, self-passivating
• Moisture resistant
*MIL-PRF-38534
CLASS H*
010
002
027
008
± 0.25% maximum ∆R/R
± 0.25% maximum ∆R/R
± 0.5% maximum ∆R/R
± 1.0% maximum ∆R/R
± 0.5% maximum ∆R/R
- 55°C to + 125°C
PROCESS CODE
- 35dB typical.
- 20dB typical.
75V maximum
10
12
250mW
200V
minimum
Document Number: 61023
CLASS K*
Revision 07-Aug-01
056
061
059
052
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BCR Summary of contents
Page 1
... MIL-STD-883. APPLICATIONS Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip ...
Page 2
... Eutectic or conductive epoxy 008 1600 PROCESS RESISTANCE CODE VALUE See Process Code Use first 4 table significant digits of resistance BCR Vishay Electro-Films TYPICAL RANGE Ω Ω 180 - 2. 3kÅ minimum gold 1 F MULTIPLIER TOLERANCE ...