BCR Vishay Intertechnology, BCR Datasheet - Page 2

• Manufacturer Part Number: BCR
• Description: 20 X 20 Ta2 N Back-contact on Silicon
• Manufacturer: Vishay Intertechnology

DIMENSIONS in inches
NOTE: Notched Shaded area represents Top Bonding Pad. The backside
OPTION:
Document Number: 61023
Revision 07-Aug-01
VISHAY ELECTRO-FILMS • FRANCE +33.4.93.37.28.24 FAX: [phone] • GERMANY +49.9287.710 FAX: [phone] • ISRAEL +972.3.557.0945 FAX: [phone]
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip size
Chip thickness
Chip substrate material
Resistor material
Bonding pad size
Number of pads
Pad material
Backing
Recommended attachment method
ORDERING INFORMATION
Example: 100% visualled, 16kΩ, ± 1%, ± 250ppm/°C TCR, Aluminum Pads, Class H
P/N:
of the chip constitutes the Second Resistor Connection.
• ITALY + 39.2.300.11911 FAX: [phone] • JAPAN +81.42.729.0661 FAX: [phone] • SINGAPORE +65.788.6668 FAX: [phone]
W = 100% visually
inspected parts in
matrix trays per
MIL-STD-883
X = Sample, visually
inspected loaded in matrix
trays (4% AQL)
• SWEDEN +46.8.594.70590 FAX: [phone] • UK [phone] FAX: [phone] • USA: [phone] FAX: [phone]
Gold bonding pads, 15kÅ minimum thickness.
Consult Applications Engineer
/PACKAGING
INSPECTION
W
TYPICAL RANGE
10
Ω
- 23
Ω
PRODUCT
FAMILY
BCR
Thin Film, Back-Contact Resistor
See Process Code
0.020
PROCESS
Back of Chip
CODE
table
008
SCHEMATIC
TYPICAL RANGE
TYPICAL RANGE
1.6K
24
Ω
0.020
Ω
- 220
- 1M
Bond Pad
Ω
Ω
significant digits
RESISTANCE
0.020 x 0.020 ± 0.002 (0.50 x 0.50 ± 0.05mm)
of resistance
Use first 4
VALUE
1600
Oxidized silicon, 10kÅ minimum SiO
0.016
0.004
0.004 x 0.004 (0.100 x 0.100mm)
Tantalum nitride, self-passivating
0.010 ± 0.003 (0.253 ± 0.05mm)
Eutectic or conductive epoxy
10kÅ minimum aluminum
3kÅ minimum gold
MULTIPLIER
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
1
CODE
1
Vishay Electro-Films
TYPICAL RANGE
180
Ω
- 2.2K
TOLERANCE
2
Ω
B = 0.1%
C = 0.2%
D = 0.5%
F = 1.0%
G = 2.0%
H = 2.5%
J = 5.0%
K = 10%
M = 20%
L = 25%
N = 50%
CODE
www.vishay.com
F
BCR
55