AD9631-EB Analog Devices, AD9631-EB Datasheet - Page 3

• Manufacturer Part Number: AD9631-EB
• Description: Ultralow Distortion/ Wide Bandwidth Voltage Feedback Op Amps
• Manufacturer: Analog Devices

REV. A
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Voltage Swing Bandwidth Product . . . . . . . . . . 550 V
Internal Power Dissipation
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . 1.2 V
Output Short Circuit Duration
Storage Temperature Range N, R . . . . . . . . . –65 C to +125 C
Operating Temperature Range (A Grade) . . . –40 C to +85 C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 C
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
NOTES
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Stresses above those listed under “Absolute Maximum Ratings” may cause
Specification is for device in free air:
8-Pin Plastic Package:
8-Pin SOIC Package:
Plastic Package (N) . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Watts
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . 0.9 Watts
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
(1.17)
0.046
(1.17)
0.046
Dimensions shown in inches and (mm).
METALIZATION PHOTO
JA
JA
= 140 C/Watt
Connect Substrate to –V
+IN
+IN
–IN
= 90 C/Watt
–IN
3
2
3
2
–V
–V
2
4
4
S
S
0.050 (1.27)
0.050 (1.27)
AD9631
AD9632
1
S
.
+V
+V
7
7
S
S
OUT
OUT
6
6
MHz
S
–3–
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by these de-
vices is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsu-
lated devices is determined by the glass transition temperature
of the plastic, approximately +150 C. Exceeding this limit tem-
porarily may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceed-
ing a junction temperature of +175 C for an extended period can
result in device failure.
While the AD9631 and AD9632 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150 C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to ob-
serve the maximum power derating curves.
Model
AD9631AN
AD9631AR
AD9631(SMD)
AD9631-EB
AD9632AN
AD9632AR
AD9632-EB
*N = Plastic DIP; Q = Cerdip; R= SOIC (Small Outline Integrated Circuit).
Temperature
Figure 2. Plot of Maximum Power Dissipation vs.
2.0
1.5
1.0
0.5
–50
0
–40
–30
Temperature
–40C to +85 C
–40 C to +85 C
–55 C to +125 C Cerdip
–40 C to +85 C
–40 C to +85 C
–20
Range
ORDERING GUIDE
–10
AMBIENT TEMPERATURE – C
8-PIN MINI-DIP PACKAGE
8-PIN SOIC PACKAGE
0 10
AD9631/AD9632
WARNING!
20 30 40
Package
Description Option*
Plastic DIP
SOIC
Evaluation
Plastic DIP
SOIC
Evaluation
Board
Board
50
ESD SENSITIVE DEVICE
60
T
J
= +150 C
70
80
Package
N-8
R-8
N-8
R-8
Q-8
90