EB02 Apex Microtechnology Corporation, EB02 Datasheet - Page 4

• Manufacturer Part Number: EB02
• Description: Motion Control
• Manufacturer: Apex Microtechnology Corporation

OPERATING
CONSIDERATIONS
POWER SUPPLY REQUIREMENTS
SUPPLY
be one supply. Also V
independently or tied together. The V
compatible with the input logic. If a high voltage logic such as
CMOS is used it may be tied with the V
requires a 5V±10% supply
SPECIAL CONSIDERATIONS
GENERAL
in a digital or DSP based motion control system. Thermal,
overvoltage, overcurrent, and crossfi re protection circuits are
part of the user’s design.
Considerations;” and Application Note 30, “PWM Basics”
for much useful information in applying this part. These
Application Notes are in the “Power Integrated Circuits Data
Book” and on line at www.apexmicrotech.com.
GROUNDING AND BYPASSING
bypassing are some of the keys to success. The EB02 is
capable of generating 2 kW pulses with 40 n-second rise and
fall times. If improperly grounded or bypassed this can cause
horrible conducted and radiated EMI.
separate power ground, named HVRTN, for each high voltage
supply. These grounds are electrically isolated from the logic
ground and each other. This isolation eliminates high current
ground loops. However, more than 5V offset between the
grounds will destroy the EB02. Apex recommends back
to back high current diodes between logic and power
grounds; this will maintain isolation but keep offset at a
safe level. All grounds should tie together at one common
point in the system.
µF or larger capacitor between HV and HVRTN. This capacitor
should be a switching power grade capacitor with ESR rated
at 20kHz. This capacitor should be placed physically as close
to the EB02 as possible.
hundred milli-ohms or so ESR.
must also be bypassed with a low ESR 1µF or larger
ceramic capacitor.
minimize the area of the loop containing high frequency
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifi ciations are subject to change without notice.
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: [phone]
4
V
V
V
HV1
HV2
HV3
V
HV1, HV2, and HV3 may be used independently, or may
The EB02 is designed to give the user maximum fl exibility
Users should read Application Note 1, "General Operating
As in any high power PWM system, grounding and
In order to reduce conducted EMI, the EB02 provides a
In order to reduce radiated EMI, Apex recommends a 100
However, such a capacitor will typically have a few
In order to minimize radiated noise, it is necessary to
cc
cc
cc
dd
1
2
3
VOLTAGE
10V to 100V
10V to 100V
10V to 100V
10V to 20V
10V to 20V
10V to 20V
4.5 to 20V
cc
1, V
cc
2, and V
Therefore, each section
10A, continuous, 20A peak
10A, continuous, 20A peak
10A, continuous, 20A peak
cc
dd
EBO2U REV. B JANUARY 2001 © 2001 Apex Microtechnology Corporation
MAX CURRENT
cc
supplies. HCMOS
3 may be used
supply must be
10mA
10mA
10mA
10mA
current. (The size of the antenna.) Therefore, the 1µF
ceramic capacitors should bypass each HV to its return at
the pins of the EB02.
SHOOT THROUGH PROTECTION
long turn off delay. Therefore, if the turn on input to an FET in
a half bridge circuit is applied simultaneously with the turn off
input to the other FET in that half bridge, there will be a time
when both FETs are simultaneously on. This "shoot through
condition" will short the power rails through the FETs, causing
excessive power dissipation and very high EMI.
must be delayed long enough for the other FET in the same
half bridge to have completely turned off.
This delay is required for both the Hin and Lin inputs.
PROTECTION CIRCUITS
FETs when at logic “1”. This input may be used with user
designed temperature sensing and current sensing circuits
to shut down the FETs in the event of a detected unsafe
condition. This is recommended since the FETs may be
turned off this way even if the normal input logic or DSP
programming is faulty.
START UP CONSIDERATIONS
for at least 2 µ-seconds to charge the bootstrap capacitor
before the top rail FET can be turned on. This must be done
no more than 330 µ-seconds prior to turning on the top rail
FET. However, a grounded load will give the same purpose
as turning on the lower rail FET. However a grounded load
will give the same purpose as turning on the lower rail
FET. Therefore a grounded load may be operated without
this consideration.
of the bootstrap bias circuit. This allows the top rail FETs to
be held on indefi nitely once turned on.
HEATSINK
dissipate 51 watts when operating at 100V, 10A, 50kHz and 3
sections simultaneously providing maximum current.
up to 16 watt per half bridge and switching losses of about 1
watt per half bridge. The conduction losses are proportional
to I
load capacitance, and switching frequency.
Power FETs have a relatively short turn on delay, and a
To avoid the shoot through condition the turn on of one FET
A delay of at least 0.5 µ-seconds is required for the EB02.
The EB02 does not include protection circuits.
However, there is a shut down input which will turn off all
The lower rail FET in the half bridge must be turned on
An internal fl oating supply is used to enhance the operation
The EB02 should be provided with suffi cient heatsink to
The dissipation is composed of conduction losses (I
out
; switching losses are proportional to HV supply voltage,
EB02
out
xV
sat
)