MAX16832C Maxim Integrated Products, MAX16832C Datasheet - Page 2

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MAX16832C

Manufacturer Part Number
MAX16832C
Description
High-Brightness LED Drivers
Manufacturer
Maxim Integrated Products
Datasheet

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2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
ABSOLUTE MAXIMUM RATINGS
IN, CS, LX, DIM to GND .........................................-0.3V to +70V
TEMP_I to GND .......................................................-0.3V to +6V
PGND to GND ......................................................-0.3V to +0.3V
CS to IN .................................................................-0.3V to +0.3V
Maximum Current into Any Pin
Continuous Power Dissipation (T
ELECTRICAL CHARACTERISTICS
(V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
2
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Input Voltage Range
Ground Current
Supply Current
UNDERVOLTAGE LOCKOUT (UVLO)
Undervoltage Lockout
Undervoltage-Lockout Hysteresis
SENSE COMPARATOR
Sense Voltage Threshold High
Sense Voltage Threshold Low
Propagation Delay to Output High
Propagation Delay to Output Low
CS Input Current
INTERNAL MOSFET
Drain-to-Source Resistance
LX Leakage Current
IN
(except IN, LX, and PGND).............................................20mA
8-Pin SO (derate 23.3mW/°C above +70°C)...........1860.5mW
_______________________________________________________________________________________
= +24V, V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
DIM
= V
IN
, T
A
= T
J
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
= +70°C)
SYMBOL
I
V
LX_LEAK
V
R
UVLO
t
t
SNSLO
I
DPDH
SNSHI
DPDL
DSON
CSIN
V
IN
No switching
V
V
0.5V
V
0.5V
MAX16832A, V
until V
MAX16832C, V
until V
MAX16832A, V
until V
MAX16832C, V
until V
Falling edge of V
260mV to V
Rising edge of V
140mV to V
V
V
I
V
I
V
LX
LX
DIM
CS
CS
IN
IN
IN
DIM
= 700mA
= 700mA
- V
= V
= V
IN
IN
= V
= V
< 0.6V, V
= 0V, V
LX
LX
LX
LX
CS
DIM
DIM
IN
IN
> 0.5V
> 0.5V
< 0.5V
< 0.5V
= 200mV, V
- 100mV, V
- 100mV, V
LX
LX
= 24V, V
= 6.0V, V
LX
= 0.5V
< 0.5V
CONDITIONS
IN
IN
IN
IN
IN
IN
IN
IN
IN
= 65V
CS
IN
= 12V
, V
, V
, V
- V
- V
- V
- V
Junction-to-Ambient Thermal Resistance (θ
Operating Temperature Range
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Pin-to-Pin ESD Ratings......................................................±2.5kV
, V
- V
- V
DIM
DIM
DIM
CS
CS
CS
CS
CS
700mA (max) Output Current ........................-40°C to +125°C
1A (max) Output Current ...............................-40°C to +105°C
DIM
IN
IN
CS
IN
IN
IN
CS
IN
= 23.9V,
rising from 140mV
rising from 140mV
falling from 260mV
falling from 260mV
= V
= 5.9V,
rising until V
falling until V
= 5V
= 5V
= 5V
= 5V
from 260mV to
from 140mV to
CS
LX
LX
<
>
MIN
201
218
185
166
6.5
A
= +25°C.)
TYP
6.25
0.45
350
210
230
190
170
1.5
0.5
50
50
1
JA
) (Note 1) .....43°C/W
MAX
216
236
198
180
6.5
6.0
3.5
0.9
65
10
2
UNITS
mA
mV
mV
µA
µA
µA
ns
ns
V
V
V

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