MAX16832C Maxim Integrated Products, MAX16832C Datasheet - Page 8

• Manufacturer Part Number: MAX16832C
• Description: High-Brightness LED Drivers
• Manufacturer: Maxim Integrated Products

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2MHz, High-Brightness LED Drivers with
Integrated MOSFET and High-Side Current Sense
For stability and best efficiency, a low forward-voltage
drop diode with fast reverse-recovery time and low
capacitance is recommended. A Schottky diode is a
good choice as long as its breakdown voltage is high
enough to withstand the maximum operating voltage.
Careful PCB layout is critical to achieve low switching
losses and stable operation. Use a multilayer board
whenever possible for better noise immunity. Minimize
ground noise by connecting high-current ground
returns, the input bypass-capacitor ground lead, and
the output-filter ground lead to a single point (star
ground configuration). In normal operation, there are two
power loops. One is formed when the internal MOSFET
8
Figure 2. Current-Regulator Operation
_______________________________________________________________________________________
V
I
DIM
LED
CURRENT
AVG. LED
HYSTERETIC
Freewheeling-Diode Selection
t1
MODE
PCB Layout Guidelines
f
SW
is on and the high current flows through IN, R
LED load, the inductor, the internal MOSFET, and GND.
The other loop is formed when the internal MOSFET is
off and the high current circulates through R
load, the inductor, and the freewheeling diode. Minimize
each loop area to reduce noise interaction.
Place R
better noise immunity, a Kelvin connection between CS
and R
Due to the integrated power MOSFET, the SO-EP pack-
age has an exposed pad to transfer the heat from the
chip to the PCB. To make the thermal resistance
between the chip and PCB lower, the exposed pad
must be soldered to the PCB. The exposed pad is con-
nected to GND.
SENSE
SENSE
is strongly recommended.
as close as possible to CS and IN. For
t2
∆I
t
SENSE
SENSE
t
, LED
,