MAX6023EBT Maxim Integrated Products, MAX6023EBT Datasheet - Page 2

• Manufacturer Part Number: MAX6023EBT
• Description: CHIP SCALE DEVICES
• Manufacturer: Maxim Integrated Products

Conclusion
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. Device Description
The MAX6023 successfully meets the quality and reliability standards required of all Maxim products. In addition,
A. General
The MAX6023 is a family of low-dropout, micropower voltage references in a 5-bump, chip-scale package (UCSP™).
The MAX6023 series-mode (three-terminal) references, which operate with input voltages from 2.5V to 12.6V (1.25V
and 2.048V options) or (V
1.25V, 2.048V, 2.5V, 3.0V, 4.096V, 4.5V, and 5.0V. These devices are guaranteed an initial accuracy of ±0.2% and
30ppm/°C temperature drift over the -40°C to +85°C extended temperature range.
UCSPs offer the benefit of moving to smaller footprint and lower profile devices, significantly smaller than even SC70
or SOT23 plastic surface-mount packages. The significantly lower profile (compared to plastic SMD packages) of the
UCSP makes the device ideal for height-critical applications. Miniature UCSP packages also enable device
placement close to sources and allow more flexibility in a complex or large design layout.
The MAX6023 voltage references use only 27µA of supply current. And unlike shunt-mode (two-terminal) references,
the supply current of the MAX6023 family varies only 0.8µA/V with supply-voltage changes, translating to longer
battery life. Additionally, these internally compensated devices do not require an external compensation capacitor
and are stable up to 2.2nF of load capacitance. The low-dropout voltage and the low supply current make these
devices ideal for battery-operated systems.
B. Absolute Maximum Ratings
(Voltages Referenced to GND)
IN
OUT
Output Short Circuit to GND or IN (VIN < 6V)
Output Short Circuit to GND or IN (VIN = 6V)
Operating Temperature Range
Storage Temperature Range
Bump Temperature (soldering, 10s)
Continuous Power Dissipation
Derates above +70°C
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal
profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of
solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR
and convection reflow. Preheating is required. Hand or wave soldering is not allowed.
5-Bump UCSP
5-Bump UCSP
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
Item
OUT
+ 0.2V) to 12.6V (all other voltage options), are available with output voltage options of
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
Rating
-0.3V to +13.5V
-0.3V to (VIN + 0.3V)
Continuous
60s
-40°C to +85°C
-65°C to +150°C
+300°C
273mW
2.4mW/°C
......Attachments