MAX6023EBT Maxim Integrated Products, MAX6023EBT Datasheet - Page 3

• Manufacturer Part Number: MAX6023EBT
• Description: CHIP SCALE DEVICES
• Manufacturer: Maxim Integrated Products

II. Manufacturing Information
III. Packaging Information
IV. Die Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
per JEDEC standard JESD22-112:
63 x 43 mils
SiN/SiO (nitride/oxide)
Aluminum/Si (Si = 1%)
None
1.2 microns (as drawn)
1.2 microns (as drawn)
5 mil. Sq.
SiO
Wafer Saw
2
Precision, Low-Power, Low-Dropout, UCSP Voltage Reference
S12 (Standard 1.2 micron silicon gate CMOS)
70
Oregon, USA
Philippines or USA
January, 2001
5-Bump UCSP
N/A
N/A
N/A
N/A
N/A
# 05-0901-0164
Class UL94-V0
Level 1