ADSP-TS101S Analog Devices, ADSP-TS101S Datasheet - Page 35

• Manufacturer Part Number: ADSP-TS101S
• Description: Embedded Processor
• Manufacturer: Analog Devices

Environmental Conditions
The ADSP-TS101S is rated for performance over the extended
commercial temperature range, T
Thermal Characteristics
The ADSP-TS101S is packaged in a 19 mm
27 mm
TS101S is specified for a case temperature (T
that the T
and/or an air flow source may be used. See
Table 29
Table 28. Thermal Characteristics
for 19 mm
1
2
3
Table 29. Thermal Characteristics
for 27 mm
1
2
3
REV. A
Parameter
Determination of parameter is system dependent and is based on a number
Per JEDEC JESD51-2 procedure using a four layer board (compliant with
Per SEMI Test Method G38-87 using a four layer board (compliant with
Parameter
Determination of parameter is system dependent and is based on a number
Per JEDEC JESD51-2 procedure using a four layer board (compliant with
Per SEMI Test Method G38-87 using a four layer board (compliant with
of factors, including device power dissipation, package thermal resistance,
board thermal characteristics, ambient temperature, and air flow.
JEDEC JESD51-9).
JEDEC JESD51-9).
of factors, including device power dissipation, package thermal resistance,
board thermal characteristics, ambient temperature, and air flow.
JEDEC JESD51-9).
JEDEC JESD51-9).
JA
JC
JB
JA
JC
JB
1
1
CASE
for thermal data.
27 mm Plastic Ball Grid Array (PBGA). The ADSP-
data sheet specification is not exceeded, a heat sink
19 mm Package
27 mm Package
Condition
Airflow
Airflow
Airflow
Condition
Airflow
Airflow
Airflow
2
3
3
2
3
3
= 0 m/s
= 1 m/s
= 2 m/s
= 0 m/s
= 1 m/s
= 2 m/s
CASE
= –40°C to +85°C.
Typical
16.6
14.0
12.9
6.7
5.8
Typical
13.8
11.7
10.8
3.1
5.9
Table 28
CASE
19 mm and
). To ensure
and
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
–35–
ADSP-TS101S