TEA1098 Philips Semiconductors, TEA1098 Datasheet - Page 31

• Manufacturer Part Number: TEA1098
• Description: Speech and handsfree IC
• Manufacturer: Philips Semiconductors

Philips Semiconductors
BONDING PAD LOCATIONS FOR TEA1098UH
All x/y coordinates represent the position of the centre of
the pad (in m) with respect to the origin (x/y = 0/0) of the
die (see Fig.20). The size of all pads is 80 m
1999 Oct 14
HFRX
TNOI
TENV
TSEN
RNOI
RSEN
RENV
DLC
n.c.
V
GALS
LSAO
n.c.
GND
GND
SLPE
LN
REG
IR
AGC
V
MICS
BB
DD
Speech and handsfree IC
SYMBOL
PAD
10
11
12
13
14
15
16
17
18
19
20
21
22
1
2
3
4
5
6
7
8
9
1299.2
1488.5
1648.8
1832.8
2393.5
129.2
345.2
805.5
1069
2028
2195
81.5
81.5
81.5
81.5
81.5
81.5
81.8
81.5
81.5
81.5
81.5
COORDINATES
X
2
.
3597.5
3402.2
2964.2
2511.8
2282.8
1972.8
1499.8
589.5
100.8
100.8
100.8
100.8
100.8
100.8
100.8
100.8
100.8
101.5
3187
2746
1023
101
Y
31
STAB
SWR
VOL
SWT
IDT
TXOUT
GATX
TXIN
GNDTX
GNDTX
MIC
MIC+
DTMF
QR
GARX
RECO
HFTX
HFC
PD
MUTE
n.c.
n.c.
n.c.
n.c.
n.c.
SYMBOL
PAD
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
2586.5
2778.8
2968.8
2968.8
2968.5
2968.5
2968.5
2290.8
2051.8
1798.2
1544.8
1296.8
657.2
459.5
2969
2969
2969
2969
2969
2969
2969
2890
2572
861
255
COORDINATES
X
Product specification
TEA1098
1342.2
1961.2
3712.8
3712.8
3712.8
3712.8
3712.8
3712.8
3712.8
2344.2
2522.8
2837.2
3062.5
3499.8
3712.8
3712.8
3712.8
3712.8
101.5
101.5
379.8
681.5
1086
2152
144
Y