TEA1098 Philips Semiconductors, TEA1098 Datasheet - Page 36

• Manufacturer Part Number: TEA1098
• Description: Speech and handsfree IC
• Manufacturer: Philips Semiconductors

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
1999 Oct 14
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Speech and handsfree IC
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
The package footprint must incorporate solder thieves downstream and at the side corners.
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(3)
, SO, SOJ
PACKAGE
not suitable
not suitable
suitable
not recommended
not recommended
36
(1)
WAVE
(3)(4)
(5)
SOLDERING METHOD
suitable
suitable
suitable
suitable
suitable
REFLOW
Product specification
TEA1098
(1)