MTSF2P03HD ON Semiconductor, MTSF2P03HD Datasheet - Page 2

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MTSF2P03HD

Manufacturer Part Number
MTSF2P03HD
Description
Medium Power Surface Mount Products Micro8
Manufacturer
ON Semiconductor
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MTSF2P03HDR2
Manufacturer:
TI
Quantity:
10 800
1. Repetitive rating; pulse width limited by maximum junction temperature.
MAXIMUM RATINGS
Negative sign for P–Channel devices omitted for clarity
Drain–to–Source Voltage
Drain–to–Gate Voltage (R GS = 1.0 M )
Gate–to–Source Voltage – Continuous
1 SQ.
FR–4 or G–10 PCB
Figure 1 below
Steady State
Minimum
FR–4 or G–10 PCB
Figure 2 below
Steady State
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy – Starting T J = 25 C
(V DD = 30 Vdc, V GS = 10 Vdc, Peak I L = 3.0 Apk, L = 159 mH, R G = 25 W)
Figure 1. 1, Square FR–4 or G–10 PCB
(T J = 25 C unless otherwise noted)
Thermal Resistance – Junction to Ambient
Total Power Dissipation @ T A = 25 C
Linear Derating Factor
Drain Current – Continuous @ T A = 25 C
Continuous @ T A = 70 C
Pulsed Drain Current (Note 1.)
Thermal Resistance – Junction to Ambient
Total Power Dissipation @ T A = 25 C
Linear Derating Factor
Drain Current – Continuous @ T A = 25 C
Continuous @ T A = 70 C
Pulsed Drain Current (Note 1.)
Rating
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MTSF2P03HD
2
Figure 2. Minimum FR–4 or G–10 PCB
Symbol
T J , T stg
R THJA
R THJA
V DGR
V DSS
V GS
E AS
I DM
I DM
P D
P D
I D
I D
I D
I D
– 55 to 150
14.29
Max
1.79
0.78
6.25
160
715
4.1
3.2
2.7
2.1
30
30
70
32
21
20
mW/ C
mW/ C
Watts
Watts
Unit
C/W
C/W
mJ
V
V
V
A
A
A
A
A
A
C

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