MPC866 Freescale Semiconductor, MPC866 Datasheet - Page 9

• Manufacturer Part Number: MPC866
• Description: (MPC859 / MPC866) Hardware Specifications
• Manufacturer: Freescale Semiconductor

4
Table 4 shows the thermal characteristics for the MPC866/859.
MOTOROLA
1
2
3
4
5
6
Junction-to-ambient
Junction-to-board
Junction-to-case
Junction-to-package top
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
Thermal characterization parameter indicating the temperature difference between package top and junction
temperature per JEDEC JESD51-2.
Thermal Characteristics
Rating
5
4
1
6
Freescale Semiconductor, Inc.
Table 4. MPC866/859 Thermal Resistance Data
For More Information On This Product,
Natural Convection
Airflow (200 ft/min)
Natural Convection
Airflow (200 ft/min)
MPC866/859 Hardware Specifications
Go to: www.freescale.com
Environment
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
Symbol
R
R
R
Thermal Characteristics
R
R
R
θ JMA
θ JMA
θ JMA
Ψ
Ψ
θ JA
θ JB
θ JC
JT
JT
2
3
3
3
Value
37
23
30
19
13
6
2
2
°C/W
Unit
9