74ABT241CSCX Fairchild Semiconductor, 74ABT241CSCX Datasheet
74ABT241CSCX
Specifications of 74ABT241CSCX
Related parts for 74ABT241CSCX
74ABT241CSCX Summary of contents
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... Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Device also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagram © 1999 Fairchild Semiconductor Corporation Features Non-inverting buffers Output sink capability of 64 mA, source capability of ...
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Absolute Maximum Ratings Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias V Pin Potential to Ground Pin CC Input Voltage (Note 2) Input Current (Note 2) Voltage Applied to Any Output in the Disabled or Power-Off State in ...
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DC Electrical Characteristics (SOIC package) Symbol Parameter V Quiet Output Maximum Dynamic V OLP OL V Quiet Output Minimum Dynamic V OLV OL V Minimum HIGH Level Dynamic Output Voltage OHV V Minimum HIGH Level Dynamic Input Voltage IHD V ...
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Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide Body www.fairchildsemi.com Package Number M20B 4 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M20D 5 www.fairchildsemi.com ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide www.fairchildsemi.com Package Number MSA20 6 ...
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves ...