MC10E1652 ON Semiconductor, MC10E1652 Datasheet - Page 5

• Manufacturer Part Number: MC10E1652
• Description: DUAL ECL OUTPUT COMPARATOR WITH LATCH
• Manufacturer: ON Semiconductor

ECLinPS and ECLinPS Lite
DL140 — Rev 4
C
-L-
0.010 (0.250)
20
Z
S
G1
G
T L –M
1
-N-
S
A
R
N
V
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE
2. DIM G1, TRUE POSITION TO BE MEASURED AT
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONING AND TOLERANCING PER ANSI
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
7. DIMENSION H DOES NOT INCLUDE DAMBAR
S
J
TOP OF LEAD SHOULDER EXITS PLASTIC BODY
AT MOLD PARTING LINE.
DATUM -T-, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER
SIDE.
Y14.5M, 1982.
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
-M-
E
Y BRK
VIEW S
0.007 (0.180)
0.007 (0.180)
-T-
W
0.004 (0.100)
SEATING
PLANE
D
D
M
M
OUTLINE DIMENSIONS
PLASTIC PLCC PACKAGE
T L –M
T L –M
CASE 775–02
FN SUFFIX
S
S
ISSUE C
B
N
N
Z
2–5
S
S
VIEW D-D
U
0.007 (0.180)
K1
X
DIM
G1
K1
W
0.007 (0.180)
A
B
C
E
F
G
H
J
K
R
U
V
X
Y
Z
K
MIN
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
—
M
2
0.050 BSC
INCHES
T L –M
VIEW S
MAX
0.395
0.395
0.180
0.019
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
0.110
10
M
—
—
—
T L –M
G1
MILLIMETERS
MIN
S
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
—
2
1.27 BSC
F
H
N
MAX
10.03
10.03
S
S
0.010 (0.250)
4.57
2.79
0.48
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
10
—
—
—
0.007 (0.180)
N
0.007 (0.180)
S
S
M
T L –M
M
T L –M
T L –M
MC10E1652
S
S
N
S
MOTOROLA
S
N
N
S
S