BD9120HFN Rohm, BD9120HFN Datasheet - Page 37

• Manufacturer Part Number: BD9120HFN
• Description: (BD9106FVM - BD9120HFN) Synchronous Buck Converter Integrated FET
• Manufacturer: Rohm

BD9106FVM BD9107FVM BD9109FVM BD9110NV BD9120HFN
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
●Operational Notes
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
www.rohm.com
1. Absolute Maximum Ratings
2. Electrical potential at GND
3. Short-circuiting between terminals, and mismounting
4.Operation in Strong electromagnetic field}
5. Thermal shutdown protection circuit
6. Inspection with the IC set to a pc board
7. Input to IC terminals
8. Ground wiring pattern
While utmost care is taken to quality control of this product, any application that may exceed some of the absolute
maximum ratings including the voltage applied and the operating temperature range may result in breakage. If broken,
short-mode or open-mode may not be identified. So if it is expected to encounter with special mode that may exceed
the absolute maximum ratings, it is requested to take necessary safety measures physically including insertion of fuses.
GND must be designed to have the lowest electrical potential In any operating conditions.
When mounting to pc board, care must be taken to avoid mistake in its orientation and alignment. Failure to do so may
result in IC breakdown. Short-circuiting due to foreign matters entered between output terminals, or between output and
power supply or GND may also cause breakdown.
Be noted that using the IC in the strong electromagnetic radiation can cause operation failures.
Thermal shutdown protection circuit is the circuit designed to isolate the IC from thermal runaway, and not intended to
protect and guarantee the IC. So, the IC the thermal shutdown protection circuit of which is once activated should not
be used thereafter for any operation originally intended.
If a capacitor must be connected to the pin of lower impedance during inspection with the IC set to a pc board, the
capacitor must be discharged after each process to avoid stress to the IC. For electrostatic protection, provide proper
grounding to assembling processes with special care taken in handling and storage. When connecting to jigs in the
inspection process, be sure to turn OFF the power supply before it is connected and removed.
This is a monolithic IC with P
the N-layer of each element form a P-N junction, and various parasitic element are formed.
If a resistor is joined to a transistor terminal as shown in Fig 106:
The structure of the IC inevitably forms parasitic elements, the activation of which may cause interference among circuits,
and/or malfunctions contributing to breakdown. It is therefore requested to take care not to use the device in such
manner that the voltage lower than GND (at P-substrate) may be applied to the input terminal, which may result in
activation of parasitic elements.
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
○if GND>Terminal B (at NPN transistor side),
○P-N junction works as a parasitic diode if the following relationship is satisfied; GND>Terminal A (at resistor side), or
GND>Terminal B (at transistor side); and
a parasitic NPN transistor is activated by N-layer of other element adjacent to the above-mentioned parasitic diode.
+
isolation between P-substrate and each element as illustrated below. This P-layer and
Fig.106 Simplified structure of monorisic IC
37/40
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TSZ02201-0J3J0AJ00090-1-2
02.MAR.2012 Rev.001
Datasheet
Datasheet pdf - http://www.DataSheet4U.net/