ISL55111 Intersil Corporation, ISL55111 Datasheet
ISL55111
Related parts for ISL55111
ISL55111 Summary of contents
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... The ISL55110 has a power down mode for low power consumption during equipment standby times, making it ideal for portable products. The ISL55110 and ISL55111 are available Exposed pad QFN packaging and 8 Ld TSSOP. Both devices are specified for operation over the full -40°C to +85°C temperature range ...
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... QFN Packages only. Provides high speed logic HIZ control of driver outputs while leaving device logic power on. IN-A Logic level input that drives Rail or Ground. Not Inverted. IN-B, INB Logic level input that drive Rail or Ground. Not inverted on ISL55110, Inverted on ISL55111. OA Driver output related to IN-A. OB Driver output related to IN-B ...
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... II_L Input Current Logic Low II_H Input Current Logic High II_L Input Current Logic Low 3 ISL55110, ISL55111 Thermal Information = +25°C) Thermal Resistance 16 Ld (4x4) QFN Package (Note TSSOP Package (Note Maximum Junction Temperature (Plastic Package +150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to +150°C Maximum Lead Temperature (Soldering 10s +300° ...
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... Minimum Pulse Width PDEN* Power-down to Power-on Time PDDIS* Power-on to Power-down Time TEN* ENABLE to ENABLE Time (HIZ Off) TDIS* ENABLE to ENABLE TIme (HIZ On) 4 ISL55110, ISL55111 = +25°C, unless otherwise specified. A TEST CONDITIONS OA, OB Design Intent verified via simulation. VH voltage to Ground PDN = Low PDN = High ...
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... INPUT ISL55110 IN INPUT RISE AND FALL TIMES ≤2ns FIGURE 1. TEST CIRCUIT RISE ( 12V IN-X INPUT ISL55110 IN INPUT RISE AND FALL TIMES ≤2ns tpdR CHN1 - tpdR CHN2 SKEW 5 ISL55110, ISL55111 +3V INPUT + 0.1μF 4.7μF ≈ 0.4V OUTPUT C L 12V OUTPUT 0V )/FALL(T R +3V INPUT + 0.1μ ...
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... VH, DRIVE RAIL (V) FIGURE 3. DRIVER RON vs VH SOURCE RESISTANCE 4.00 3.66 3.33 VH 5.0V 2.66 2.33 2.00 2.5 3.5 VDD (V) FIGURE 5. RON vs VDD SOURCE RESISTANCE 4.0 3.8 3.6 3.4 3.2 3.0 2.5 3.5 VDD (V) FIGURE 7. IDD vs VDD QUIESCENT CURRENT 6 ISL55110, ISL55111 (See Typical Performance Curves Discussion) VDD 3.6V -50mA +25°C -40° 4.00 50mA 3.66 3.33 VH 12.0V 2.66 2.33 2.00 4.5 5 AND 12V 4.5 5.5 7.0 6.3 5.6 +85°C +25°C 4 ...
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... TOGGLE FREQUENCY IN Hz FIGURE 11. IDD vs FREQUENCY (DUAL CHANNEL, NO LOAD)L 1.5 1.4 -40°C 1.3 1.2 1.1 1.0 2.5 3.5 VDD (V) FIGURE 13. VIH LOGIC THRESHOLDS 7 ISL55110, ISL55111 (Continued) (See Typical Performance Curves Discussion) 200 VDD 3.6V 180 160 140 120 100 200 180 160 140 120 ...
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... PACKAGE TEMP (°C) FIGURE 17. tpd vs TEMPERATURE 100pF/1k 680pF 330pF 2.5 3.5 VDD (V) FIGURE 19 VDD r 8 ISL55110, ISL55111 (Continued) (See Typical Performance Curves Discussion 1000pF 12.0V VDD 3.6V 0 -40 + 1000pF ...
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... VDD (V) FIGURE 23. tpd vs VDD 680pF 100pF/1k 330pF (V) FIGURE 25. tpd ISL55110, ISL55111 (Continued) (See Typical Performance Curves Discussion) 12.0 1000pF 10.8 9.6 8.4 7.2 6.0 4.8 3.6 2.4 1.2 VDD 3.3V 0 12. 1000pF 2 0 4.5 5.5 2.5 20 VDD 3 ...
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... PACKAGE TEMP (°C) FIGURE 27. tskew vs TEMPERATURE r 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 330pF 0.0 2.5 3.5 VDD (V) FIGURE 29. tskew vs VDD r 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 330pF 0 VDD (V) FIGURE 31. tskew ISL55110, ISL55111 (Continued) (See Typical Performance Curves Discussion) 1.0 VH 12.0V 0.9 VDD 3.6V 0.8 0.7 0.6 330pF 0.5 0.4 0.3 0.2 0.1 0.0 +50 +85 -40 1.0 VH 12.0V 0.9 0.8 0.7 0.6 0.5 680pF 0.4 0.3 0.2 0.1 0.0 2.5 4.5 5.5 1.0 VDD 3.3V 0.9 0.8 0.7 0.6 0.5 680pF 0.4 0.3 0.2 0.1 0 680pF AND 330pF -10 +20 +50 PACKAGE TEMP (°C) FIGURE 28 ...
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... Voltage Drop from Driver Out to Ground measured for RON Calculations. Dynamic Tests All dynamic tests are conducted with ISL55110, ISL55111 Evaluation Board(s). Driver Loads are soldered to the Evaluation board. Measurements are collected with P6245 Active Fet Probes and TDS5104 Oscilloscope. Pulse Stimulus is provided by HP8131 pulse generator ...
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... ISL55111 two drivers operating in antiphase. Both inputs of the device have independent inputs to allow external time phasing if required. In addition to power MOS drivers, the ISL55110, ISL55111 is well suited for other applications such as bus, control signal, and clock drivers on large memory of microprocessor boards, where the load capacitance is large and low propagation delays are required ...
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... Power Supply Sequencing The ISL55110, ISL55111 references both VDD and the VH driver supplies with respect to Ground. Therefore apply VDD, then VH. Digital Inputs should never be open. Do not apply slow analog ramps to the inputs. Again place decoupling as close to the package as possible for both VDD and especially VH ...
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... Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) 14 ISL55110, ISL55111 L16.4x4A 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGD-10) SYMBOL MIN 0. θ - NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. ...
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... However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 15 ISL55110, ISL55111 M8.173 8 LEAD THIN SHRINK NARROW BODY SMALL OUTLINE M ...