ISL59448 Intersil Corporation, ISL59448 Datasheet - Page 9

• Manufacturer Part Number: ISL59448
• Description: Multiplexing Amplifier
• Manufacturer: Intersil Corporation

Typical Performance Curves
FIGURE 25. PACKAGE POWER DISSIPATION vs AMBIENT
1.2
0.8
0.6
0.4
0.2
1
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD - QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
1.136W
TEMPERATURE
25
AMBIENT TEMPERATURE (°C)
50
θ
JA
QSOP24
9
=88°C/W
75
85
100
V
S
125
=
±
5V, R
150
L
= 500Ω to GND, T
ISL59448
A
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT
= 25°C, unless otherwise specified. (Continued)
1.2
0.8
0.6
0.4
0.2
1
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
870mW
TEMPERATURE
25
AMBIENT TEMPERATURE (°C)
50
θ
JA
QSOP24
75
=115°C/W
85
100
125
March 29, 2006
150
FN6160.2