ISL9021 Intersil Corporation, ISL9021 Datasheet - Page 9

• Manufacturer Part Number: ISL9021
• Description: Single LDO
• Manufacturer: Intersil Corporation

www.DataSheet4U.com
Wafer Level Chip Scale Package
(WLCSP 0.4mm Ball Pitch)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
SE
A1
PIN 1
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
E
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
BOTTOM VIEW
B
For information regarding Intersil Corporation and its products, see www.intersil.com
TOP VIEW
SIDE VIEW
SD
D
b
9
b
A
2
1
e ( D1 )
e ( E1 )
A2
A
ISL9021
W2x2.4
2x2 ARRAY 4 BALL WAFER LEVEL CHIP SCALE PACKAGE
NOTES:
1. All dimensions are in millimeters.
SYMBOL
SD
A1
A2
D1
E1
SE
A
D
E
b
e
NUMBER OF BUMPS: 4
0.44 Min, 0.495 Nom, 0.55 Max
MILLIMETERS
0.190 ±0.030
0.305 ±0.025
0.270 ±0.030
1.155 ±0.020
0.400 BASIC
0.975 ±0.020
0.400 BASIC
0.400 BASIC
0.200 BASIC
0.00 BASIC
Rev. 2 6/08
June 12, 2009
FN6867.1