ISL97702 Intersil Corporation, ISL97702 Datasheet - Page 12

• Manufacturer Part Number: ISL97702
• Description: Boost
• Manufacturer: Intersil Corporation

PCB layout Considerations
The layout is very important for the converter to function
properly. To ensure the high pulse current in the power
ground does not interfere with the sensitive feedback
signals, the current loops (V
V
DFN package, there is no separated GND. All return GNDs
should be connected in GND pin but with no sharing branch.
Demo Board Layout
OUT
-C
OUT
FIGURE 21. OVERVIEW of DEMO BOARD
-GND) should be as short as possible. For the
IN
12
-L1-LX-GND, and V
FIGURE 23. TOP LAYER of the DEMO BOARD
IN
-L1-
ISL97702
The heat of the IC is mainly dissipated through the thermal
pad. Maximizing the copper area connected to the thermal
pad is preferable. In addition, a solid ground plane is helpful
for the EMI performance.
The demo board is a good example layout based on the
principle. The overview, top layer and bottom layer of the
demo board layout are shown in Figures 21, 22 and 23.
FIGURE 22. BOTTOM LAYER of the DEMO BOARD
October 13, 2005
FN7462.0