BYW29G-200 STMicroelectronics, BYW29G-200 Datasheet
![no-image](/images/manufacturer_photos/0/6/637/stmicroelectronics_sml.jpg)
BYW29G-200
Available stocks
Related parts for BYW29G-200
BYW29G-200 Summary of contents
Page 1
... Surge non repetitive forward current FSM (All pins connected) I Repetitive peak forward current FRM Tstg Storage and junction temperature range Tj October 1999 - Ed PAK, this Parameter Tc=120 C = 0.5 tp=10ms sinusoidal kHz BYW29G-200 PAK (Plastic) Value Unit 200 ...
Page 2
... BYW29G-200 THERMAL RESISTANCE Symbol Rth (j-c) Junction to case thermal resistance STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter I * Reverse leakage current R V Forward voltage drop F ** Pulse test : * ms, duty cycle < 380 s, duty cycle < evaluate the conduction losses use the following equation : 0. 0.040 I ...
Page 3
... Single pulse 100 0.1 1.0E-03 1.0E-02 Fig.6 : Average current versus ambient tempera- ture. (duty cycle : 0.5) I F(av)( Tc= =0 Tc= Tc=120 C 1 =tp BYW29G-200 =tp/T tp P=15W 1 T =tp/T tp tp(s) 1.0E-01 1. 0E+00 Rth(j-a)=Rth(j-c) o Rth(j-a)=15 C/W Tamb 100 120 140 160 3/5 ...
Page 4
... BYW29G-200 Fig.7 : Junction capacitance versus reverse volt- age applied (Typical values). C(pF) F=1Mhz Tj=25 C VR(V) Fig.9 : Peak reverse current versus dIF/dt. I RM(A) 90% CONFIDENCE Tj-100 C O dIF/dt(A/us) 4/5 Fig.8 : Recovery charges versus dI QRR(nC) o 90%CONFIDENCE Tj- Fig.10 : Dynamic parameters versus junction tem- perature. QRR;IRM[Tj]/QRR;IRM[Tj=125 C] IF=IF(av) /dt. ...
Page 5
... A 4.40 A1 2. 0.70 B2 1.14 C 0. 8.95 E 10.00 G 4.88 L 15.00 L2 1. 5.08 1.30 http://www.st.com BYW29G-200 DIMENSIONS Inches Max. Min. Max. 4.60 0.173 0.181 2.69 0.098 0.106 0.23 0.001 0.009 0.93 0.027 0.037 1.70 0.045 0.067 0.60 0.017 0.024 1.36 0.048 0.054 9.35 0.352 0.368 10.40 0.393 0.409 5.28 0.192 0.208 15.85 0.590 0.624 1 ...