T6316B Taiwan Memory Technology, T6316B Datasheet - Page 6

• Manufacturer Part Number: T6316B
• Description: Constant-Current White LED Bias Supply
• Manufacturer: Taiwan Memory Technology

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PACKAGE DIMENSIONS
8-LEAD SOP
TM Technology Inc. reserves the right
to change products or specifications without notice.
Symbol
*Note :
PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a
large amount of current can be sunk safely in one package.
C 2
A1
B1
C1
C2
A
D
K
H
B
C
E
F
The thermal pad on the IC’s bottom has to be mounted on the copper foil.
To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.
In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on
J
Min.
5.70
3.75
1.35
0.10
0.31
0.30
0.10
CH
B 1
TE
-
-
-
T h e r m a l P a d *
Dimension in mm
K
B
2.23 REF
2.97 REF
D
Typ.
6.00
3.95
1.27
1.55
0.41
0.50
0.15
0~8°
-
-
-
J
Max.
6.30
4.10
5.13
1.80
1.75
0.25
0.51
0.70
0.25
-
C 1
A 1
C
A
H
0.224
0.148
0.052
0.001
0.012
0.012
0.004
Min.
-
-
-
P. 6
Dimension in inch
0.088 REF
0.117 REF
0~8°
0.236
0.156
0.050
0.061
0.016
0.020
0.006
Typ.
-
-
-
Preliminary T6316A/B
Max.
0.248
0.164
0.202
0.071
0.069
0.004
0.020
0.028
0.010
-
Publication Date: JUN. 2006
E
F
Revision: B