74HCT7030D,112 NXP Semiconductors, 74HCT7030D,112 Datasheet

IC 9X64 FIFO REGISTER 3ST 28SOIC

74HCT7030D,112

Manufacturer Part Number
74HCT7030D,112
Description
IC 9X64 FIFO REGISTER 3ST 28SOIC
Manufacturer
NXP Semiconductors
Series
74HCTr
Datasheets
1.74HCT4046ADB112.pdf (19 pages)
2.74HCT4046ADB112.pdf (23 pages)
3.74HC7030D652.pdf (22 pages)

Specifications of 74HCT7030D,112

Function
Asynchronous, Synchronous
Memory Size
576 (9 x 64)
Data Rate
33MHz
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
28-SOIC (7.5mm Width)
Logic Family
HCT
Logical Function
FIFO Register
Number Of Elements
1
Number Of Bits
9
Number Of Inputs
9
Number Of Outputs
9
High Level Output Current
-6mA
Low Level Output Current
6mA
Propagation Delay Time
117ns
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Output Type
3-State
Polarity
Non-Inverting
Technology
CMOS
Frequency (max)
36(Typ)MHz
Mounting
Surface Mount
Pin Count
28
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Quiescent Current
50uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Access Time
-
Lead Free Status / Rohs Status
Compliant
Other names
568-2900-5
933798900112
INTEGRATED CIRCUITS
DATA SHEET
Package outline drawings
January 1996
File under Integrated Circuits, IC06

Related parts for 74HCT7030D,112

Image
Part Number
Description
Manufacturer
Datasheet
Request R
74hct7030
Part Number:
74hct7030
Description:
9-bit X 64-word Fifo Register; 3-state
Manufacturer:
NXP Semiconductors
Datasheet:
74HCT7030.pdf (22 pages)
LPC2420_60
Part Number:
LPC2420_60
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2420_60.pdf (86 pages)
LPC2458
Part Number:
LPC2458
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2458.pdf (80 pages)
LPC2468
Part Number:
LPC2468
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2468.pdf (85 pages)
LPC2470
Part Number:
LPC2470
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2470.pdf (91 pages)
LPC2478
Part Number:
LPC2478
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
LPC2478.pdf (93 pages)
XA-G30
Part Number:
XA-G30
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G30.pdf (36 pages)
XA-G37
Part Number:
XA-G37
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
XA-G37.pdf (37 pages)
XA-S3
Part Number:
XA-S3
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
XA-S3.pdf (52 pages)
LH75401_LH75411_N
Part Number:
LH75401_LH75411_N
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
LH75401_LH75411_N.pdf (63 pages)
LPC3130_3131
Part Number:
LPC3130_3131
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
LPC3130_3131.pdf (68 pages)
LPC3141FET180
Part Number:
LPC3141FET180
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3143FET180
Part Number:
LPC3143FET180
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3152FET208
Part Number:
LPC3152FET208
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
LPC3154FET208
Part Number:
LPC3154FET208
Description:
The NXP LPC3154 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors

74HCT7030D,112 Summary of contents

Page 1

DATA SHEET Package outline drawings File under Integrated Circuits, IC06 INTEGRATED CIRCUITS January 1996 ...

Page 2

Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DIP SOT27-1 plastic dual in-line package; 14 leads (300 mil) SOT38-4 plastic dual in-line package; 16 leads (300 mil) SOT146-1 plastic dual in-line package; 20 leads (300 mil) SOT101-1 plastic dual in-line ...

Page 3

Philips Semiconductors Package outline drawings DIP DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b ...

Page 4

Philips Semiconductors Package outline drawings DIP16: plastic dual in-line package; 16 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 5

Philips Semiconductors Package outline drawings DIP20: plastic dual in-line package; 20 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT b max. min. ...

Page 6

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (600 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. ...

Page 7

Philips Semiconductors Package outline drawings DIP24: plastic dual in-line package; 24 leads (300 mil pin 1 index 1 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions UNIT b max. min. ...

Page 8

Philips Semiconductors Package outline drawings DIP28: plastic dual in-line package; 28 leads (600 mil) handbook, full pagewidth pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT ...

Page 9

Philips Semiconductors Package outline drawings SO SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 10

Philips Semiconductors Package outline drawings SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 11

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 12

Philips Semiconductors Package outline drawings SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 13

Philips Semiconductors Package outline drawings SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 14

Philips Semiconductors Package outline drawings SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 15

Philips Semiconductors Package outline drawings SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 16

Philips Semiconductors Package outline drawings SSOP SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 17

Philips Semiconductors Package outline drawings SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 18

Philips Semiconductors Package outline drawings SSOP20: plastic shrink small outline package; 20 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 19

Philips Semiconductors Package outline drawings SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 20

Philips Semiconductors Package outline drawings TSSOP TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 21

Philips Semiconductors Package outline drawings TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 22

Philips Semiconductors Package outline drawings TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Page 23

Philips Semiconductors Package outline drawings TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT ...

Related keywords