BCM847DS NXP Semiconductors, BCM847DS Datasheet

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... Product profile 1.1 General description NPN/NPN matched double transistors in small Surface-Mounted Device (SMD) plastic packages. The transistors are fully isolated internally. Table 1. Type number BCM847BV BCM847BS BCM847DS 1.2 Features I Current gain matching I Base-emitter voltage matching I Drop-in replacement for standard double transistors 1.3 Applications ...

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... Pin Ordering information Table 4. Type number BCM847BV BCM847BS BCM847DS 4. Marking Table 5. Type number BCM847BV BCM847BS BCM847DS [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BCM847BV_BS_DS_5 Product data sheet Quick reference data …continued Parameter Conditions h matching ...

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Philips Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBO tot Per device P tot amb ...

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Philips Semiconductors Table 7. Symbol Per device R th(j-a) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless ...

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Philips Semiconductors Table unless otherwise specified. amb Symbol Per device h /h FE1 FE2 V V BE1 BE2 [1] V BEsat [2] V decreases by about 2 mV/K with increasing temperature. BE ...

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Philips Semiconductors 0.20 I (mA 4.05 C 3.60 (A) 3.15 0.16 0.12 0.08 0. amb Fig 1. Collector current as a function of collector-emitter voltage; typical values ...

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Philips Semiconductors (V) 0.8 0.6 0 amb Fig 5. Base-emitter voltage as a function of collector current; typical values (pF) 4 ...

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Philips Semiconductors 8. Application information out TR1 006aaa523 Fig 9. Current mirror 9. Package outline 1.7 1 1.7 1.3 1.5 1.1 pin 1 index 1 2 0.5 1 Dimensions in mm Fig 11. Package ...

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... Philips Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description BCM847BV BCM847BS BCM847DS [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping BCM847BV_BS_DS_5 Product data sheet ...

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Philips Semiconductors 11. Soldering Reflow soldering is the only recommended soldering method. Fig 14. Reflow soldering footprint SOT666 Fig 15. Reflow soldering footprint SOT363 (SC-88) BCM847BV_BS_DS_5 Product data sheet 2.75 2.45 2.10 0.55 2.00 1.70 1. 1.20 2.20 ...

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Philips Semiconductors Dimensions in mm Fig 16. Wave soldering footprint SOT363 (SC-88) 3.30 Dimensions in mm Fig 17. Reflow soldering footprint SOT457 (SC-74) BCM847BV_BS_DS_5 Product data sheet 5.25 4.50 solder lands 1.15 3.75 solder resist occupied area transport direction during ...

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Philips Semiconductors 5.05 Dimensions in mm Fig 18. Wave soldering footprint SOT457 (SC-74) BCM847BV_BS_DS_5 Product data sheet BCM847BV/BS/DS NPN/NPN matched double transistors 5.30 0.45 1.45 4.45 1.40 4.30 Rev. 05 — 27 June 2006 www.DataSheet4U.com solder lands solder resist occupied ...

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Philips Semiconductors 12. Revision history Table 10. Revision history Document ID Release date BCM847BV_BS_DS_5 20060627 • Modifications: Type number BCM847BV added • Section 13 “Legal BCM847BS_DS_4 20060216 BCM847BS_DS_3 20060123 BCM847BS_2 20050406 BCM847BS_1 20040914 BCM847BV_BS_DS_5 Product data sheet BCM847BV/BS/DS NPN/NPN matched ...

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Philips Semiconductors 13. Legal information 13.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

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Philips Semiconductors 15. Contents 1 Product profi 1.1 General description ...