PEMH30 NXP Semiconductors, PEMH30 Datasheet - Page 3

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PEMH30

Manufacturer Part Number
PEMH30
Description
Pemh30; Pumh30 Npn/npn Double Resistor-equipped Transistors; R1 = 2.2 Kohm, R2 = Open
Manufacturer
NXP Semiconductors
Datasheet

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Part Number
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Part Number:
PEMH30
Manufacturer:
NXP
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Philips Semiconductors
5. Limiting values
6. Thermal characteristics
PEMH30_PUMH30_1
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 7.
[1]
[2]
Symbol
Per transistor
V
V
V
I
I
P
Per device
P
T
T
T
Symbol
Per transistor
R
Per device
R
O
CM
j
amb
stg
CBO
CEO
EBO
tot
tot
th(j-a)
th(j-a)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to ambient
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current
peak collector current
total power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k , R2 = open
SOT363
SOT666
SOT363
SOT666
SOT363
SOT666
SOT363
SOT666
Rev. 01 — 28 March 2006
Conditions
open emitter
open base
open collector
single pulse;
t
T
T
p
Conditions
in free air
in free air
amb
amb
1 ms
25 C
25 C
PEMH30; PUMH30
[1][2]
[1][2]
[1]
[1]
[1][2]
[1][2]
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[1]
[1]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
65
65
Typ
-
-
-
-
Max
50
50
5
100
100
200
200
300
300
150
+150
+150
Max
625
625
416
416
Unit
V
V
V
mA
mA
mW
mW
mW
mW
Unit
K/W
K/W
K/W
K/W
C
C
C
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