SMP80MC STMicroelectronics, SMP80MC Datasheet - Page 8
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SMP80MC
Manufacturer Part Number
SMP80MC
Description
TRISIL
Manufacturer
STMicroelectronics
Datasheet
1.SMP80MC.pdf
(10 pages)
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Package information
3
8/10
Package information
●
Table 5.
Figure 12. Footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
C
Epoxy meets UL94, V0
SMB dimensions
E1
E
L
D
1.62
A2
A1
2.60
5.84
b
1.62
Ref.
A1
A2
E1
D
E
b
c
L
Min.
1.90
0.05
1.95
0.15
5.10
4.05
3.30
0.75
Millimeters
2.18
Max.
2.45
0.20
2.20
0.40
5.60
4.60
3.95
1.50
Dimensions
0.075
0.002
0.077
0.006
0.201
0.159
0.130
0.030
Min.
Inches
SMP80MC
0.096
0.008
0.087
0.016
0.220
0.181
0.156
0.059
Max.