MMFT3055VL Motorola, MMFT3055VL Datasheet
MMFT3055VL
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MMFT3055VL Summary of contents
Page 1
... I DSS and V DS(on) Specified at Elevated Temperature Static Parameters are the Same for both TMOS V and TMOS E–FET Available Tape & Reel Use MMFT3055VLT1 to order the 7 inch/1000 unit reel Use MMFT3055VLT3 to order the 13 inch/4000 unit reel MAXIMUM RATINGS ( unless otherwise noted) Drain– ...
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... MMFT3055VL ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage ( Vdc 0.25 mAdc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc Vdc 150 C) Gate–Body Leakage Current ( ...
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... Figure 4. On–Resistance versus Drain Current 1000 100 10 1 175 125 150 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage MMFT3055VL 100 C 1.5 2 2.5 3 3.5 4 4.5 5 5 1.5 2 2 DRAIN CURRENT (AMPS) ...
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... MMFT3055VL Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...
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... DM ), the energy rating is specified at rated continuous cur- rent ( accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 13). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MMFT3055VL t d(off d(on) 10 ...
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... MMFT3055VL SINGLE PULSE 100 ms 500 ms 0 DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 0 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 0.001 SINGLE PULSE 0.0001 1.0E–05 1.0E–04 1.0E–03 Figure 14. Diode Reverse Recovery Waveform ...
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... Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. MMFT3055VL mm Board Material = 0.0625 G–10/FR– Copper ...
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... MMFT3055VL Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure ...
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... C 160 C 150 C SOLDER IS LIQUID FOR SECONDS 140 C (DEPENDING ON 100 C MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES Figure 16. Typical Solder Heating Profile MMFT3055VL STEP 6 STEP 7 VENT COOLING 205 TO 219 C PEAK AT SOLDER JOINT T MAX 9 ...
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... DIM MIN MAX MIN MAX A 0.249 0.263 6.30 6.70 B 0.130 0.145 3.30 3.70 C 0.060 0.068 1.50 1.75 D 0.024 0.035 0.60 0.89 F 0.115 0.126 2.90 3.20 G 0.087 0.094 2.20 2.40 H 0.0008 0.0040 0.020 0.100 J 0.009 0.014 0.24 0.35 K 0.060 0.078 1.50 2.00 L 0.033 0.041 0.85 1. 0.264 0.287 6.70 7.30 STYLE 3: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN MMFT3055VL/D ...