MAS1175 Micro Analog systems, MAS1175 Datasheet

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MAS1175

Manufacturer Part Number
MAS1175
Description
IC FOR 10.00 - 20.00 MHz VCTCXO
Manufacturer
Micro Analog systems
Datasheet
DESCRIPTION
The MAS1175 is an integrated circuit well suited to
build VCTCXO for mobile communication. Only two
external components are needed. Temperature
calibration is achieved with three calibration points
only. The trimming is done through a serial bus and
the calibration information is stored in an internal
PROM.
FEATURES
BLOCK DIAGRAM
Very small size
Minimum current draw
Wide operating temperature range
Phase noise <-130 dBc/Hz at 1 kHz offset
VCTCXO for mobile phones
CLK
VDD
PV
DA
VC
VSS
CDAC1
CDAC2
SENS
CUB
INF
LIN
4
4
4
8
8
2
f(T)
f(T)
X2
IC FOR 10.00 – 20.00 MHz VCTCXO
Σ
T
APPLICATIONS
To
components, a varactor and a crystal are needed.
The compensation method is fully analog. IC
compensation
generating any steps or other interferences.
MAS1175
• Low Power
• Wide Supply Voltage Range
• True Sine Wave Output
• Very High Level of Integration
• Very Low Phase Noise
X1
Vref
VCTCXO for other telecommunications
systems
build
Electrically Trimmable
Low Cost
TMux
a
VCTCXO
work
TE1
TE2
OUT
is
only
continuous
MAS1175
two
13 July, 2006
DA1175.008
additional
without
1 (9)

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MAS1175 Summary of contents

Page 1

... DESCRIPTION The MAS1175 is an integrated circuit well suited to build VCTCXO for mobile communication. Only two external components are needed. Temperature calibration is achieved with three calibration points only. The trimming is done through a serial bus and the calibration information is stored in an internal PROM. ...

Page 2

PIN DESCRIPTION Pin Description Power Supply Voltage Programming Input Serial Bus Clock Input Serial Bus Data Input Temperature Output Test Multiplexer Output Voltage Control Input Crystal Oscillator Output Crystal/Varactor Oscillator Input Power Supply Ground Buffer Output Note: Because the substrate ...

Page 3

... IC OUTLINES VDD Die map reference Note 1: MAS1175A pads are round with 95 µm diameter at opening. Note 2: Pins PV and TE1 shall not be connected and pins CLK and DA can either be connected to VSS or left open in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. ...

Page 4

DEVICE OUTLINE CONFIGURATION MSOP10 (SnPb) TE2 DA CLK PV VDD A = product version Y = year WW= week OUT TE2 VSS DA Top View X2 CLK VDD A = product version Y = year WW= week ...

Page 5

PACKAGE (MSOP-10) OUTLINE Symbol (Terminal length for soldering Dimensions do not include mold ...

Page 6

SOLDERING INFORMATION N For Sn/Pb MSOP-10 Resistance to Soldering Heat Maximum Temperature Maximum Number of Reflow Cycles Reflow profile Seating Plane Co-planarity Lead Finish N For Pb Free, RoHS Compliant MSOP-10 Resistance to Soldering Heat Maximum Temperature Maximum Number of ...

Page 7

EMBOSSED TAPE SPECIFICATIONS User Direction of Feed Dimension Pin 1 Designator Min/Max 5.00 ...

Page 8

REEL SPECIFICATIONS A D Reel Material: Conductive, Plastic Antistatic or Static Dissipative End Trailer Dimension (measured at hub (measured at hub) 2 Trailer Leader of which minimum 160 mm of empty carrier ...

Page 9

... ORDERING INFORMATION Product Code Product MAS1175ATB1 IC FOR VCTCXO MAS1175ASM1-T IC FOR VCTCXO MAS1175A1SN06 IC FOR VCTCXO Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products ...

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