da6270 Micro Analog Systems Oy, da6270 Datasheet
da6270
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da6270 Summary of contents
Page 1
... Output is either CMOS or a true sine wave resulting in lower harmonics than with clipped sine wave output. APPLICATIONS VCTCXO modules for mobile phones • VCTCXO modules for other applications • DA6270.002 16 October 2008 MAS6270 working continuously without 1 (10) ...
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... MOUT 140 TIN 624 DA 771 CLK 1083 PV 1256 VDD 1718 VC 1687 XOUT 1210 XIN 848 VSS 495 OUT 134 DA6270.002 16 October 2008 TIN VREF TEST MOUT MUX OUT 2 Buffer+ divider y-coordinate 142 142 142 142 140 142 1219 1219 ...
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... Crystal pulling sensitivity S Crystal Rs R Note 1: CDACF = 32 and CDACC = 8 Symbol Min V – V –0 -0 MAX T – ±100 LUT Conditions L S DA6270.002 16 October 2008 Max Unit Note 6 0 150 C mA Min Typ Max Unit 2.6 2.8 5 –40 ...
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... TBD -0.7 0.0 INF 20 START -90 -113 φ -136 n -148 -155 is used. DD DA6270.002 16 October 2008 Unit Note MHz 1) MHz ppm/V 2) ppm 3) 8) ppm 4) 8) ppm 3) 9) ppm 4) 9) Vpp 5) 8) Vpp dBc 8) ...
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... Note 2: Pins CLK, DA and PV can either be connected to VSS or left floating, and pin TIN must be left floating in VCTCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. Note 4: See coordinates in pin description on page 2. MAS VSS XIN XOUT 6270 TIN DA CLK PV 1840 um Figure 2. IC outlines. DA6270.002 16 October 2008 VC 1360 um VDD 5 (10) ...
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... OUT 19 VSS 18 17 Top marking: XIN 16 YYWW = Year, Week XXXXX.X = Lot number 15 XOUT Figure 3. MAS6270 SBDIL-20 package product version MSOP10 X = voltage version Top View Y = year WW= week Figure 4. MAS6270 MSOP-10 package DA6270.002 16 October 2008 OUT VSS XIN XOUT VC 6 (10) ...
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... See Detail 5-15 Degrees L1 Detail Degrees L Min Nom -- -- 0.00 -- 0.75 0.85 0.15 -- 0.15 --- 0.08 0.08 3.00 BSC 4.90 BSC 3.00 BSC 0.50 BSC 4.8 0.50 0.40 0.60 0.95 REF 0.25 BSC 0.41 1.02 0.50 Reference Standard : JEDEC MO-187 BA. DA6270.002 16 October 2008 (b) B Section Land F Pattern Recommendation Gauge Plane L2 Seating Plane G Max Unit 1.10 mm 0.15 mm 0.95 mm 0.30 mm 0.25 mm 0. ...
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... According to RSH test IEC 68-2-58/20 2*220°C Solder plate 7.62 - 25.4 µm, material Sn 85 Pin 1 Designator Min/Max 5.00 ±0.10 3.20 ±0.10 1.50 +0.1/-0.0 1.50 min 1.75 5.50 ±0.05 1.45 ±0.10 4.0 8.0 ±0.10 2.0 ±0.05 0.3 ±0.05 12.00 +0.30/-0.10 DA6270.002 16 October 2008 235°C 2 max 0. Section A-A Unit (10) ...
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... Weight Tape Slot for Tape Start B 5000 Components on Each Reel Carrier Tape Material: Conductive Components Min Max 330 1.5 12.80 13.50 20.2 50 12.4 14.4 18.4 160 390, 1500 DA6270.002 16 October 2008 Carrier Tape Cover Tape Start Leader Unit ...
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... WA9 = 215 µm thick EWS tested wafer SM1 = MSOP Pb free RoHS Tel. (09) 80 521 Tel. Int. +358 9 80 521 Telefax +358 9 805 3213 Email: info@mas-oy.com DA6270.002 16 October 2008 Comments Die Size 1.840 x 1.360 mm Die Size 1.840 x 1.360 mm T&R 5000 pcs / r, Pb free RoHS T& ...