MAS6720 Micro Analog systems, MAS6720 Datasheet - Page 3

• Manufacturer Part Number: MAS6720
• Description: IC FOR 32.768 kHz XO
• Manufacturer: Micro Analog systems

PIN DESCRIPTION
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
IC OUTLINES
Note1: Die map reference is the actual left bottom corner of the sawn chip.
Note2: See coordinates in pin description.
Note3: Die dimensions include 80 µm scribes for both sides.
Pin Description
Power Supply Voltage
Power Supply for Output Buffer
Crystal Oscillator Input
Crystal Oscillator Output
Power Supply Ground
Buffer Output
Die Map Reference
VDD
VD
BUFF
Figure 2. IC outlines.
VDBUFF
Symbol
XOUT
VDD
OUT
VSS
XIN
MAS6720
XOUT
730 um
x-coordinate
XIN
141
141
450
303
588
588
OUT
VSS
720 um
y-coordinate
2 January 2007
569
376
141
141
379
594
DA6720.000
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