BYQ30EB Philips Semiconductors, BYQ30EB Datasheet

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BYQ30EB

Manufacturer Part Number
BYQ30EB
Description
Rectifier diodes ultrafast/ rugged
Manufacturer
Philips Semiconductors
Datasheet
1.BYQ30EB.pdf (6 pages)
Philips Semiconductors
GENERAL DESCRIPTION
Glass passivated high efficiency
rugged dual rectifier diodes in a
plastic envelope suitable for surface
mounting, featuring low forward
voltage drop, ultra-fast recovery
times
characteristic. These devices can
withstand reverse voltage transients
and have guaranteed reverse surge
and ESD
intended for use in switched mode
power supplies and high frequency
circuits
conduction and switching losses are
essential.
PINNING - SOT404
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
1 Neglecting switching and reverse current losses.
October 1997
Rectifier diodes
ultrafast, rugged
SYMBOL PARAMETER
V
V
V
I
I
I
I
I
I
I
T
T
O(AV)
O(RMS)
FRM
FSM
2
RRM
RSM
PIN
t
stg
j
mb
RRM
RWM
R
1
2
3
no connection
cathode
anode
cathode
in
and
capability. They
Repetitive peak reverse voltage
Crest working reverse voltage
Continuous reverse voltage
Output current (both diodes
conducting)
RMS forward current
Repetitive peak forward current t = 25 s;
per diode
Non-repetitive peak forward
current per diode
I
Repetitive peak reverse current t
per diode
Non-repetitive peak reverse
current per diode
Storage temperature
Operating junction temperature
2
general
DESCRIPTION
t for fusing
soft
where
1
recovery
low
are
QUICK REFERENCE DATA
PIN CONFIGURATION
SYMBOL
V
V
I
t
I
O(AV)
rr
RRM
RRM
F
CONDITIONS
square wave
T
t = 10 ms
t = 8.3 ms
sinusoidal; with reapplied
V
t = 10 ms
t
p
p
mb
RWM(max)
1
= 0.5; T
= 2 s; = 0.001
= 100 s
2
104 ˚C
3
PARAMETER
Repetitive peak reverse
voltage
Forward voltage
Output current (both
diodes conducting)
Reverse recovery time
Repetitive peak reverse
current per diode
mb
1
= 0.5;
mb
104 ˚C
BYQ30EB-
MIN.
-40
-
-
-
-
-
-
-
-
-
-
-
-
SYMBOL
MAX.
0.95
100
100
0.2
16
25
-100
100
100
100
tab
k
BYQ30EB series
MAX.
0.95
MAX.
150
150
0.2
Product specification
-150
16
25
150
150
150
100
110
150
150
0.2
0.2
16
23
16
50
MAX.
0.95
-200
200
200
200
200
200
0.2
16
25
Rev 1.000
a
3
UNIT
UNIT
A
˚C
˚C
ns
V
V
V
A
A
A
A
A
A
A
V
V
A
A
2
s

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BYQ30EB Summary of contents

Page 1

... CONDITIONS square wave = 0.5; T 104 ˚ 0.5; T 104 ˚ 8.3 ms sinusoidal; with reapplied V RWM(max 0.001 100 Product specification BYQ30EB series MAX. MAX. MAX. UNIT 100 150 200 100 150 200 V 0.95 0.95 0. ...

Page 2

... -dI /dt = 100 -dI / 100 ˚ / Product specification BYQ30EB series MIN. MAX. UNIT - 8 kV MIN. TYP. MAX. UNIT - - 3.0 K 2.5 K K/W MIN. TYP. MAX. UNIT - 0.83 ...

Page 3

... D = 1.0 120 0.5 126 100 132 138 10 T 144 t T 150 f(I ) per F F(AV) 3 Product specification BYQ30EB series BYQ30 Tmb(max 1.9 2.2 2 Average forward current, IF(AV) (A) = f(I F factor = F(RMS) F(AV) trr / ns IF=10A IF= dIF/dt (A/us) Fig.5. Maximum ˚C. ...

Page 4

... IF=1A 10 1.0 1.0 100 = 25 ˚ IF=1A 0.1 0.01 100 100 ˚C. Fig.11. Transient thermal impedance BYQ30 1 Product specification BYQ30EB series IF=10A -dIF/dt (A/us) Fig.10. Maximum ˚ Transient thermal impedance, Zth j-mb (K/ 0.1 s pulse width, tp (s) th j-mb 100 t ...

Page 5

... Epoxy meets UL94 V0 at 1/8". MOUNTING INSTRUCTIONS Dimensions in mm Notes 1. Plastic meets UL94 V0 at 1/8". October 1997 10.3 max 11 max 15.4 0.85 max (x2) Fig.12. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.13. SOT404 : minimum pad sizes for surface mounting . 5 Product specification BYQ30EB series 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.000 ...

Page 6

... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. October 1997 BYQ30EB series 6 Product specification Rev 1.000 ...

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