UPD78F9418A NEC, UPD78F9418A Datasheet - Page 298

• Manufacturer Part Number: UPD78F9418A
• Description: (UPD7894xxA) 8-Bit Single Chip Microcontrollers
• Manufacturer: NEC

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recommended conditions.
representative.
Caution Do not use different soldering methods together (except for partial heating).
The µ PD789407A and µ PD789417A Subseries should be soldered and mounted under the following
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
µ PD789405AGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD789406AGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD789407AGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD789415AGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD789416AGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD789417AGC-×××-8BT: 80-pin plastic QFP (14 × 14)
µ PD78F9418AGC-8BT:
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS
Table 24-1. Surface Mounting Type Soldering Conditions (1/2)
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C
or higher), Count: Twice or less
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C
or higher), Count: Twice or less
Soldering bath temperature: 260°C max., Time: 10 seconds max.,
Count: 1, Preheating temperature: 120°C max. (package surface
temperature)
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
80-pin plastic QFP (14 × 14)
User’s Manual U13952EJ3V0UD
Soldering Conditions
IR35-00-2
VP15-00-2
WS60-00-1
Recommended Condition
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