HCTS190DMSR Intersil Corporation, HCTS190DMSR Datasheet
HCTS190DMSR
Related parts for HCTS190DMSR
HCTS190DMSR Summary of contents
Page 1
... LSTTL Input Compatibility - VIL = 0.8V Max - VIH = VCC/2 Min • Input Current Levels VOL, VOH Ordering Information PART NUMBER TEMPERATURE RANGE HCTS190DMSR HCTS190KMSR HCTS190D/Sample HCTS190K/Sample HCTS190HMSR Pinouts 16 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T16, LEAD FINISH C TOP VIEW ...
Page 2
Functional Diagram U FF0 FUNCTION Count Up Count Down Asynchronous Preset No Change H = High Level L = Low Level X ...
Page 3
Absolute Maximum Ratings Supply Voltage (VCC -0.5V to +7.0V Input Voltage Range, All Inputs . . ...
Page 4
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL TPLH VCC = 4.5V TPHL VCC = 4. TPLH VCC = 4.5V TPHL VCC = 4. TPLH VCC = 4.5V TPHL VCC = ...
Page 5
TABLE 3. ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Capacitance Power Dissipation CPD Input Capacitance CIN Output Transition Time TTHL TTLH Maximum Operating Frequency FMAX (CPU, CPD) Setup Time TSU Setup Time TSU Setup Time TSU ...
Page 6
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETER SYMBOL Output Voltage Low VOL VCC = 4.5V and 5.5V, VIH = VCC/2, VIL = 0.8V, IOL = 50 A Output Voltage High VOH VCC = 4.5V and 5.5V, VIH ...
Page 7
CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate group A testing in ...
Page 8
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 9
... All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use ...
Page 10
Die Characteristics DIE DIMENSIONS: 104 x 86 mils METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY < 2 A/cm BOND PAD SIZE: ...