HCTS540 Intersil Corporation, HCTS540 Datasheet - Page 10

• Manufacturer Part Number: HCTS540
• Description: Radiation Hardened Inverting Octal Buffer/Line Driver/ Three-State
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
101 x 85mils
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCTS540 is TA14455A.
5
2
A/cm
Å
2
A1 (3)
A2 (4)
A3 (5)
A4 (6)
A5 (7)
A6 (8)
2.6k
Å
Å
1k
Å
(9)
A7
A0
(2)
GND
(10)
OE1
HCTS540MS
(1)
HCTS540MS
10
VCC
(20)
(11)
Y7
OE2
(19)
(12)
Y6
(18) Y0
(17) Y1
(16) Y2
(15) Y3
(14) Y4
(13) Y5
Spec Number
518631