AD8147 Analog Devices, AD8147 Datasheet - Page 7

• Manufacturer Part Number: AD8147
• Description: Triple Differential Driver for Wideband Video
• Manufacturer: Analog Devices

ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
All V
Power Dissipation
Input Common-Mode Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for the device soldered in a circuit board in still air.
Table 4. Thermal Resistance with the Underside Pad
Connected to the Plane
Package Type/PCB Type
24-Lead LFCSP/4-Layer
Maximum Power Dissipation
The maximum safe power dissipation in the AD8146/
AD8147/AD8148 package is limited by the associated rise in
junction temperature (T
which is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
can change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
AD8146/AD8147/AD8148. Exceeding a junction temperature
of 175°C for an extended time can result in changes in the
silicon devices, potentially causing failure.
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
JA
is specified for the worst-case conditions, that is, θ
OCM
S
). The load current consists of differential
J
) on the die. At approximately 150°C,
θ
57
JA
D
) is the sum of the
Unit
°C/W
Rating
11 V
±V
See Figure 3
±V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
S
S
S
) times the
JA
is
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and common-mode currents flowing to the loads, as well as
currents flowing through the internal differential and common-
mode feedback loops. The internal resistor tap used in the
common-mode feedback loop places a 4 kΩ differential load on
the output. Differential feedback, network resistor values are
given in the Theory of Operation section and Applications
section. RMS output voltages should be considered when
dealing with ac signals.
Airflow reduces θ
with the package leads from metal traces, through holes,
ground, and power planes reduces the θ
on the underside of the package must be soldered to a pad on
the PCB surface that is thermally connected to a ground plane
to achieve the specified θ
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 24-lead LFCSP
(57°C/W) package on a JEDEC standard 4-layer board with the
underside paddle soldered to a pad that is thermally connected
to a ground plane. θ
ESD CAUTION
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–40
–20
JA
. In addition, more metal directly in contact
JA
values are approximations.
AMBIENT TEMPERATURE (°C)
AD8146/AD8147/AD8148
JA
0
.
20
JA
40
. The exposed paddle
60
80